Panasonic Intellectual Property Management Co., Ltd.

Nayuta Minami

Nobuaki Shimamoto

Ryota Sudo

Naoki Kobayashi

Shoya Kida

An infrared sensor includes: a package body; an infrared sensor chip mounted on a front surface of the package body; an outside cap made of metal, having a function of transmitting infrared light as a detection target for the infrared sensor chip, and attached to the package body such that the outside cap is in front of, and covers, the infrared sensor chip; an inside cap made of metal, having a function of transmitting the infrared light as the detection target for the infrared sensor chip, and disposed between the package body and the outside cap such that the inside cap is in front of, and covers the infrared sensor chip; and a ground terminal to be connected to external ground. The outside cap is electrically insulated from the inside cap and the infrared sensor chip. The inside cap is electrically connected to the ground terminal.

Infrared sensor

An infrared processing system includes a first thermal image generating unit, an object extracting unit, a second thermal image generating unit, and an object temperature calculating unit. The first thermal image generating unit generates, using a first temperature correction value, a first thermal image based on the output signal of the image sensor. The object extracting unit extracts the object from the first thermal image. The second thermal image generating unit generates, using a second temperature correction value corresponding to the object that has been extracted by the object extracting unit, a second thermal image based on the output signal of the image sensor. The object temperature calculating unit calculates, based on the second thermal image that has been generated by the second thermal image generating unit, a temperature of the object that has been extracted by the object extracting unit.

Growing community of inventors

Fukui, Japan

Nayuta Minami