Amp LLC

The Whitaker Corporation

Navin N Vyas

John R Rowlette

Warren C Jones

Ricky C Mellinger

James L Joyce, Jr

David F MacInnes, Jr

John F Jasinski

James K Draper

Robert P McCormick

The invention relates to an electrically conductive silicone gel having a combination of conductive particles comprising silver coated mica and oxide free silver flakes uniformly dispersed therethrough, where said gel is characterized as non-flowing, self-healing, and thermally stable, with a volume resistivity of less than about 2.0 milliohm-cm.

Electrically conductive gel

This invention is directed to an electrically conductive gel comprising an extrinsically conductive gel having dispersed therein a quantity of an intrinsically conductive polymer, where said polymer is present in the amount of between about 0.03 to 1.6%, by weight. Preferred conductive polymers are those selected from the class of polypyrrole, polyaniline, polyanisidine, polythiophene, and derivatives of these base polymers.

Extrinsically/intrinsically conductive gel

The present invention discloses a method for laminating at least two polymer films. An intermediate assembly 40 is made comprising an adhesive film 20 and a dielectric polymer film 12. The method comprises the steps of: selecting an adhesive film 20 with a melting point T.sub.1, the adhesive film having inner and outer major surfaces 22, 24; selecting a polymer film 12, with a melting point T.sub.2, where T.sub.2 &gt;T.sub.1, the polymer film having inner and outer major surfaces 14, 16; subjecting the inner surface 14 of the polymer film 12 to a high voltage electric discharge to form a treated inner surface; heating the polymer film 12 having the treated inner surface to a temperature greater than T.sub.1 ; aligning the inner adhesive surface 22 and the inner treated polymer surface 14 in opposed facing relationship; applying pressure to urge the films 12, 20 relatively together; and heating the pressed together films to a temperature greater than T.sub.1 ; whereby the adhesive film 20 adheres to the polymer film 12 to form the intermediate laminated assembly 40. The intermediate assembly 40 is bondable to another substrate 28 to form a resultant laminated assembly 42, which may be formed into an article such as connector 44 wherein the intermediate laminate 40 remains assuredly bonded to substrate 28.

Method for laminating polymer films

This invention is directed to a non-flammable plating resist with improved adhesion and edge covering characteristics which permits its selective removal by an ordinary laser ablation process or an energy efficient laser assisted process, and to the preferred method in using same to selectively plate a metal substrate, such as a nickel plated, electrically conductive metal with a precious metal. The preferred method comprises the steps of applying a thin uniform layer of such resist onto the substrate and drying the same in situ to a thickness greater than 100 microinches and less than 500 microinches, and drying same in situ, where such resist (a) is resistant to deterioration by chemical plating solutions of such precious metal, (b) is readily strippable in alkaline solutions, and (c) has a flashpoint in excess of 100.degree. F. A preferred formulation for such resist comprises, by weight, the following:

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Winston-Salem, NC, United States of America

Navin N Vyas