Intel Corporation

Naveen Matam

Altug Koker

Sanjeev S Jahagirdar

Varghese George

Lakshminarayanan Striramassarma

Josh B Mastronarde

Vikranth Vemulapalli

Iqbal Rajwani

Lance Cheney

Eric Finley

Melaku Teshome

Binoj Xavier

Abhishek R Appu

Joydeep Ray

Subramaniam M Maiyuran

Vasanth Ranganathan

Nikos Kaburlasos

Lidong Xu

Aditya Navale

Scott R Janus

James M Holland

Xinmin Tian

Brent E Insko

Michael K Dwyer

Ke Yin

Brian D Rauchfuss

Durgaprasad Bilagi

Wing Hang Wong

Anthony Babella

Allan Wong

Apparatuses including a graphics processing unit, graphics multiprocessor, or graphics processor having an error detection correction logic for cache memory or shared memory are disclosed. In one embodiment, a graphics multiprocessor includes cache or local memory for storing data and error detection correction circuitry integrated with or coupled to the cache or local memory. The error detection correction circuitry is configured to perform a tag read for data of the cache or local memory to check error detection correction information.

Systems and methods for error detection and control for embedded memory and compute elements

A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, cache or DRAM memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.

Enabling product SKUs based on chiplet configurations

Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

Disaggregation of system-on-chip (SOC) architecture

Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

Disaggregation of System-On-Chip (SOC) architecture

A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.

Enabling product SKUS based on chiplet configurations

Disaggregation of SOC architecture

Methods and apparatus relating to mid-thread pre-emption with software assisted context switch are described. In an embodiment, one or more threads executing on a Graphics Processing Unit (GPU) are stopped at an instruction level granularity in response to a request to pre-empt the one or more threads. The context data of the one or more threads is copied to memory in response to completion of the one or more threads at the instruction level granularity and/or one or more instructions. Other embodiments are also disclosed and claimed.

Mid-thread pre-emption with software assisted context switch

Provided are a method and system for loading test data into execution units in a graphics card to test the execution units. Test instructions are loaded into a cache in a graphics module comprising multiple execution units coupled to the cache on a bus during a design test mode. The cache instructions are concurrently transferred to an instruction queue of each execution unit to concurrently load the cache instructions into the instruction queues of the execution units. The execution units concurrently execute the cache instructions to fetch test instructions from the cache to load into memories of the execution units and execute during the design test mode.

Loading test data into execution units in a graphics card to test execution

Growing community of inventors

Rancho Cordova, CA, United States of America

Naveen Matam