Applied Materials, Inc.

Intel Corporation

Naveed Zaman

Tameesh Suri

Myron O Shak

Bilal Shafi Sheikh

Aravind Raghavendra Dasu

Sreedhar Ravipalli

Rakesh Cheerla

Martin Horne

A router may include input buffers that receive a packet being transmitted from a source to a destination, a state generator that determines a state for the packet, and a memory representing weights for actions corresponding to possible states. The memory may be configured to return an action corresponding to the state of the packet, where the action may indicate a next hop in the route between the source and the destination. The router may also include reward logic configured to generate the weights for the plurality of actions in the memory. The reward logic may receive a global reward corresponding to the route between the source and the destination, calculate a local reward corresponding to next hops available to the router; and combine the global reward and the local reward to generate the weights for the plurality of actions in the memory.

Router architecture for multi-dimensional topologies in on-chip and on-package networks

A smart network interface controller (NIC) implemented using a stacked die configuration is provided. The NIC may include user-customizable networking circuits formed in a top programmable die and primitive network function blocks formed in a bottom application-specific integrated circuit (ASIC) die. The top programmable die may provide a flexible packet processing pipeline to facilitate efficient control and data communication between the user-customizable networking circuits and the primitive network function blocks. The bottom ASIC die may also include an array of memory blocks operable as lookup tables and intermediate buffers for other network processing circuitry in the NIC. A NIC configured in this way provides both performance, power, and area benefits and superior customer configurability.

Stacked die network interface controller circuitry

A network-on-package (NoPK) for connecting a plurality of chiplets may include a plurality of interface bridges configured to convert a plurality of protocols used by the plurality of chiplets into a common protocol, a routing network configured to route traffic between the plurality of interface bridges using the common protocol, and a controller configured to program the plurality of interface bridges and the routing network based on types of the plurality of chiplets connected to the NoPK. The NoPK may provide a scalable connection for any number of chiplets from different ecosystems using different communication protocols.

Scalable network-on-package for connecting chiplet-based designs

Growing community of inventors

Saratoga, CA, United States of America

Naveed Zaman