Corning Incorporated

Navaneetha Krishnan Subbaiyan

Shrisudersan Jayaraman

Prantik Mazumder

William Richard Trutna

Scott Christopher Pollard

Jeffrey Stapleton King

Ah-Young Park

Chukwudi Azubuike Okoro

A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.

Methods for making electrodes and providing electrical connections in sensors

A waveguide sensor system is provided. The system includes a light source and a waveguide formed from a light transmitting material. Light from the light source enters the waveguide at an input area and travels within the waveguide by total internal reflection to an analyte area and light to be analyzed travels within the waveguide from the analyte area by total internal reflection to an output area. An optical sensor is coupled to the output area and is configured to interact with the light to be analyzed. The system includes a plurality of pores located along the outer surface within the analyte area and formed in the light transmitting material of the waveguide, and the pores are configured to enhance light interaction with the analyte within the analyte area. The pores and analyte area may be protected and/or enhanced with a hydrophobic layer overlaying the pores.

Assembly having nanoporous surface layer with hydrophobic layer

According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, &#x3a6;, of less than or equal to 30 &#x3bc;m, and the axial length, L, and the maximum diameter, &#x3a6;, satisfy an equation: 

Hermetic fully-filled metallized through-hole vias

A method of forming an article, including: inserting a conductive material within a via a wafer, wherein the conductive material comprises a first alloy comprising a first metal and a second metal; and contacting the conductive material with a solution comprising ions of a third metal, wherein the ions of the third metal galvanically displace a portion of the second metal from the first alloy to form a second alloy with the first metal.

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Portland, OR, United States of America

Navaneetha Krishnan Subbaiyan