Hitachi Power Solutions Co., Ltd.

Natsuki Sugaya

Kazuhiro Noda

Kaoru Kitami

Masamichi Umeda

Masafumi Takada

Shigeru Ohno

Kotaro Kikukawa

An ultrasound image apparatus irradiates a bonded wafer in which two or more wafers are bonded with an ultrasonic wave to generate an image of the bonded surface between the wafers. An ultrasonic probe irradiates the bonded wafer with the ultrasonic wave on a lower side of the bonded wafer. A liquid ejection unit moves together with the ultrasonic probe while continuously ejecting a liquid toward a bottom surface such that a liquid film in contact with the bottom surface is formed between the liquid ejection unit and the bottom surface of the bonded wafer. Also, a gas ejection device ejects gas for pushing down the liquid toward an outer peripheral end portion of the bonded wafer so that the liquid ejected from the liquid ejection unit does not infiltrate into the bonded surface from the outer peripheral end portion of the bonded wafer.

Ultrasound image apparatus and liquid infiltration prevention method into bonded wafer

An ultrasonic imaging device includes an ultrasonic probe including a piezoelectric device transmitting ultrasonic waves to a sample and receiving echo waves, an X axis scanner and a Y axis scanner scanning the sample and positions the probe at a scanning position, a frequency controller controlling a frequency of a received signal in accordance with the position of the scanning position, a signal processing unit processing the received signal, and an image generator generating an ultrasonic wave image at the frequency based on an output of the signal processing unit. The frequency controller generates and supplies a burst signal having a predetermined frequency by a burst wave oscillator to the piezoelectric device of the ultrasonic probe to generate the ultrasonic waves having a predetermined frequency.

Measurement frequency variable ultrasonic imaging device

Growing community of inventors

Katsushika, Japan

Natsuki Sugaya