Ngk Insulators, Inc.

Natsuki Hirata

Hiroshi Takebayashi

Rishun Kin

Tatsuya Kuno

Seiya Inoue

Kenji Yonemoto

Shinya Yoshida

Kengo Torii

Taro Usami

Shinya Hasegawa

Aoi Saito

A member for a semiconductor manufacturing apparatus, includes: a ceramic plate that has a ceramic plate through hole; an electroconductive base plate that has a base plate through hole and that is disposed on a lower surface side of the ceramic plate; an insulating sleeve which is inserted into the base plate through hole and of which an outer peripheral surface is adhered to an inner peripheral surface of the base plate through hole via an adhesion layer; and a sleeve through hole that passes through the insulating sleeve in the up-down direction and that communicates with the ceramic plate through hole. The insulating sleeve has a tool engaging portion that is engageable with an external tool, and upon being engaged with the external tool, the tool engaging portion transmits rotation torque of the external tool to the insulating sleeve.

Member for semiconductor manufacturing apparatus

A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.

In a ceramic heater, a central-zone heating resistor and an outer-peripheral-zone heating resistor are embedded in a disc-like ceramic base having a wafer-mounting surface on one side. The central-zone heating resistor is a wire extending in a single continuous line from one of a pair of terminals to the other. The pair of terminals as a whole form a circular shape in plan view.

Wafer-heating device

An electrostatic chuck heater is such that a sheet heater formed by embedding a heater wire in a resin sheet is disposed between an electrostatic chuck and a support pedestal. The heater wires are provided one for each of many zones of the resin sheet, and are composed of copper wires routed unicursally from their first ends to their second ends so as to extend throughout the zones.

Electrostatic chuck heater

A metal wiring bonding structurecomprises contactsof connection FPCand heater landsof a sheet heaterto be bonded by a solder bonding member. A connection FPCincludes contact opposed landsfamed of metal and disposed at positions respectively opposed to the plurality of contactson a surface of a support layeropposite from a surface on which metal wiresare provided, and through holespenetrating the contact opposed lands, the support layer, and contacts. Solder bonding memberscover surfaces of contact opposed landsand are filled inside through holesand in a bonding space C.

Metal wiring bonding structure and production method therefor

An electrostatic chuck heater includes an electrostatic chuck in which an electrostatic electrode is embedded in a ceramic sintered body; a small-zone formation region including a plurality of small zones in which small heater electrodes are wired; a power source to which the plurality of small heater electrodes are connected in parallel; and a small-zone control apparatus that performs control such that desired electric power is supplied to each of the small heater electrodes, wherein among the plurality of small heater electrodes, a small heater electrode that is wired in a small zone including a cool spot has a resistance that is set to a smaller value than that of the other small heater electrodes.

A metal wiring bonding structurecomprises contactsof connection FPCand heater landsof a sheet heaterto be bonded by a solder bonding memberA connection FPCincludes contact opposed landsformed of metal and disposed at positions respectively opposed to the plurality of contactson a surface of a support layeropposite from a surface on which metal wiresare provided. In addition to base surfacesopposed to the contactsthe heater landsrespectively include extended surfacesopposed to imaginary extended portionsimaginarily extended ahead from the contactsA solder bonding membercovers surfaces of the contact opposed landsa distal end surface of the connection FPCand the extended surfacesof the heater landsand is filled in a bonding space C.

Growing community of inventors

Handa, Japan

Natsuki Hirata