Nippon Soda Co., Ltd.

Nisso Chemical Analysis Service Co., Ltd.

Natsuki Amanokura

Kazuo Ono

Masami Kaneko

Hiroshi Suzuki

Yuichi Maekawa

Kiyoshi Katsuura

Tetsuya Sahara

Yoshihiro Enomoto

Hitoshi Matsumoto

Emi Nakayama

Naoyuki Kamegaya

An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): 

Composition for formation of cured epoxy resin, and cured products thereof

A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where Rrepresents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where Rrepresents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and Rto Reach independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent. 

Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C-Calkyl group, phenyl group, benzyl group or cyanoethyl group, and Rto Rrepresent a hydrogen atom, nitro group, halogen atom, C-Calkyl group, phenyl group, benzyl group, hydroxymethyl group or C-Cacyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein Rto Reach represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.

Epoxy resin composition, curing agent, and curing accelerator

A clathrate compound containing a polymolecular host compound as a host compound and an agricultural chemical active ingredient having a saturated solubility in water at 25&#xb0; C. of not less than 500 ppm as a guest compound.

Clathrate compound, method for controlling concentration of aqueous agricultural chemical active ingredient solution, and agricultural chemical formulation

The present invention provides a clathrate compound characterized by containing: a polymolecular host compound as a host compound; and an agricultural chemical active ingredient having a saturated solubility in water at 25&#xb0; C. of not less than 500 ppm as a guest compound. The present invention also provides a method for controlling the concentration of an aqueous agricultural chemical active ingredient solution, characterized by containings a step of including an agricultural chemical active ingredient having high saturated solubility in an interior space formed of a polymolecular host compound, thereby maintaining the saturated solubility of the agricultural chemical active ingredient in water within a predetermined concentration range. The present invention also provides an agricultural chemical formulation containing the clathrate compound. The present invention also provides an agricultural active composition containing the clathrate compound and a synthetic pyrethroid.

Growing community of inventors

Ichihara, Japan

Natsuki Amanokura