Sony Corporation

Sony Group Corporation

Natsuhiro Aota

Tomohiro Takahashi

Yoshiyuki Akiyama

Takashi Miyamoto

Hajime Yamagishi

Kenichi Shigenami

Yutaka Nishimura

Atsushi Muto

Yuusaku Kobayashi

Takayuki Sekihara

Hayato Gouji

Takayuki Kai

Rena Kagawa

Makoto Hayafuchi

To provide a solid-state image sensor in which two or more semiconductor chips are bonded together without voids occurring in their bonding surfaces despite the conductive films bonded together at a high areal ratio. The solid-state image sensor includes at least a first semiconductor chip carrying thereon one or more than one of a first conductor and a pixel array, and a second semiconductor chip which bonds to the first semiconductor chip and carries thereon one or more than one of a second conductor and a logic circuit, with the first semiconductor chip and the second semiconductor chip bonding together in such a way that the first conductor and the second conductor overlap with each other and are electrically connected to each other, and the bonding occurring such that the first conductor and the second conductor differ from each other in the area of their bonding surfaces.

Solid-state image sensor, method for producing solid-state image sensor, and electronic device

The present technology relates to a circuit substrate, an image sensor, and an electronic apparatus that are capable of suppressing generation of noise in a conductor loop, which is caused due to a change in the conductor loop. A circuit substrate according to the present technology includes a circuit that is formed of a conductor and is capable of forming a conductor loop, at least a part of the dimensions of the conductor loop being variable; and a plurality of conductors that are each formed at a position where an induced electromotive force is generated in the conductor loop by a magnetic field and each have a structure that suppresses a change in the induced electromotive force generated by a change in dimensions of the conductor loop, the magnetic field being generated by the plurality of conductors. The present technology is applicable to, for example, an image sensor and an electronic apparatus.

Circuit substrate, image sensor, and electronic apparatus

Growing community of inventors

Fukuoka, Japan

Natsuhiro Aota