Altera Corporation

Nathaniel Wright Unger

Kyung Suk Oh

Xiaohong Jiang

In one embodiment, an integrated circuit die includes first and second inductor structures, a first ground conductor, a second ground conductor and a conductive trace. The first ground conductor provides a first ground pathway for the first inductor structure. The second ground conductor provides a second ground pathway for the second inductor structure. The conductive trace coupled between the first and second ground conductors may magnetically decouple the first and second inductor structures. In addition, the integrated circuit die may also include conductive guard ring structures that surround the first and second inductor structures. One of the conductive guard ring structures may be connected to the first grounding pathway and the other conductive guard ring structure may be connected to the second grounding pathway. The conductive guard ring structures may further magnetically decouple the first and second inductor structures.

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San Jose, CA, United States of America

Nathaniel Wright Unger