US Government As Represented by the Secretary of the Army

Nathaniel J Bidner

Joshua D Wattier

In one embodiment, an enclosure device for a printed circuit board (PCB) comprises: an enclosure wall structure including therein a heater exchanger, a pipe to direct a cooling liquid through the heat exchanger, and a ducting to direct a gas through the heat exchanger to be cooled by the cooling liquid; and a PCB space adjacent to a portion of the enclosure wall structure for receiving the PCB. The ducting includes a downstream duct disposed downstream of the heat exchanger and extending through the portion of the enclosure wall structure adjacent to the PCB space to direct the cooled gas to the portion of the enclosure wall structure adjacent to the PCB space.

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Champaign, IL, United States of America

Nathaniel J Bidner