3m Innovative Properties Company

Nathan P Kreutter

Ravi Palaniswamy

Jian Gao

Andrew John Ouderkirk

Rui Yang

Christopher G Dunn

Justine A Mooney

Arokiaraj Jesudoss

Alejandro Aldrin Il Agcaoili Narag

Fong Liang Tan

Qihong Nie

James R White

Moses Mekala David

Guoping Mao

Muthu Sebastian

Dennis M Brunner

Michael S Graff

Alejandro Aldrin A Narag, Ii

Dominic M Travasso

James S McHattie

David L Buster

Kihoon Sung

Woo-Young Ahn

Daniel K Luebbert

Augusto A Noronha, Iii

James S Mchattie

A flexible polymeric dielectric layer () having first and second major surfaces, the first major surface having a conductive layer () thereon, the dielectric layer having at least one conduit () extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (), the conductive layer including at least one conductive feature () substantially aligned with the conduit (), the conductive feature () supporting a plurality of light emitting semiconductor devices ().

Flexible light emitting semiconductor device with large area conduit

A reflection sheet and a method of manufacturing a reflection sheet are disclosed. The reflection sheet comprises a substrate layer and a reflective layer formed on the substrate layer, wherein the reflective layer comprises an alloy consisting of silver (Ag), palladium (Pd) and neodymium (Nd).

Reflection sheet and method of manufacturing the same

Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.

Flexible LED device and method of making

Provided is a flexible light emitting semiconductor device (), such as an LED device, that includes a flexible dielectric layer () having first and second major surfaces and at least one via () extending through the dielectric layer from the first to the second major surface, with a conductive layer () on each of the first and second major surfaces and in the via. The conductive layer () in the via supports a light emitting semiconductor device () and is electrically isolated from the conductive layer () on the first major surface of the dielectric layer.

Flexible LED device for thermal management

The present invention relates to partially rigid flexible circuits having both rigid portions and flexible portions and methods for making the same.

Partially rigid flexible circuits and method of making same

A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 &#x3bc;m to about 60 &#x3bc;m including at least one thinned, recessed region wherein the thickness is reduced to less than 15 &#x3bc;m, as required for use of the dielectric film in e.g. ink jet print head, hard disk drive head gimbal assembly and touch sensor applications.

Controlled depth etched dielectric film

Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.

Partially etched dielectric film with conductive features

A disk drive suspension assembly including an elongated polymeric base member having a plurality of traces formed directly on a first surface thereof and a reference voltage layer formed on a second surface thereof. A support member is formed directly on at least a portion of the reference voltage layer. The plurality of traces overlay at least a portion of the reference voltage layer. The reference voltage layer is formed from a first electrically conductive material and the support member is formed from a second electrically conductive material. The first electrically conductive material providing substantially greater electrical conductivity and substantially less tensile strength than the second electrically conductive material. The support member includes a head gimbal portion having a first thickness and a load beam portion having a second thickness. The second thickness is substantially greater than the first thickness.

Hard disk drive suspension with integral flexible circuit

Growing community of inventors

Austin, TX, United States of America

Nathan P Kreutter