Intel Corporation

Nathan P Heckathorne

Bassam Mohammed Ziadeh

Douglas Heymann

Alin Ila

Described herein are pick and place devices having reconfigurable nozzle subassemblies, as well as related devices and methods. In some embodiments, a pick and place device may have a reusable base plate, and a plurality of reusable vacuum nozzle subassemblies that are removably coupled to the base plate in a first configuration. In some embodiments, plurality of vacuum nozzle subassemblies may be removed, then removably re-coupled to the base plate in a second configuration. In some embodiments, a pick and place device may include a base plate, a plurality of nozzle subassemblies removably attached to the base plate, where individual nozzle subassemblies include a vacuum nozzle, a vacuum connection, and a base; and a top plate coupled to the base plate, where the top plate includes a plurality of openings configured to seat the plurality of nozzle subassemblies.

Pick and place tooling with adjustable nozzle configuration

A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

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Chandler, AZ, United States of America

Nathan P Heckathorne