Dfr Solutions, LLC

D&r Solutions, LLC

Nathan John Blattau

Craig Damon Hillman

Danko Dmitrievich Priimak

Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.

Surface mount testing system

In one embodiment, a first set of inputs which describe aspects of a device may be received. A second set of inputs may be automatically provided for a group of assessments, included in an analysis, based on the first set of inputs and information in at least one database. An analysis may be performed based on the second set of inputs to assess the reliability of the device. A report may be generated based on the performed analysis.

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Waldorf, MD, United States of America

Nathan John Blattau