Adesto Technologies Corporation

Nathan Gonzales

John Dinh

Derric Lewis

Venkatesh P Gopinath

Gideon Intrater

Ming Sang Kwan

Bard Pedersen

Deepak Kamalanathan

Derric Jawaher Herman Lewis

An integrated circuit (IC) device can include static random access memory (SRAM) cells that each include a pair of latching devices, and first and second resistive elements disposed over the latching devices. The first resistive element can be conductively connected to a first data latching node by a first vertical connection. The second resistive element can be conductively connected to a second data latching node by a second vertical connection. Each resistive element can include at least one memory layer that is capable of being programmed between at least a high and lower resistance state by application of electric fields, the resistive elements having only the high resistance state.

Static random access memories with programmable impedance elements and methods and devices including the same

A method of controlling an ultra-deep power down (UDPD) mode in a memory device, can include: receiving a write command from a host via an interface; beginning a write operation on the memory device to execute the write command; reading an auto-UDPD (AUDPD) configuration bit from a status register; completing the write operation on the memory device; automatically entering the UDPD mode upon completion of the write operation in response to the AUDPD configuration bit being set; and entering a standby mode upon completion of the write operation in response to the AUDPD configuration bit being cleared.

Ultra-deep power down mode control in a memory device

A method of controlling write parameter selection in a memory device, can include: (i) storing a configuration set number in a configuration register, where the configuration register is accessible by a user via an interface; (ii) receiving a write command from a host via the interface; (iii) comparing the stored configuration set number against set numbers in a register block to determine a match or a mismatch; (iv) downloading configuration bits from a memory array into the register block in response to the mismatch determination; (v) selecting a configuration set corresponding to the stored configuration set number from the register block in response to the match determination; and (vi) using the selected configuration set to perform a write operation on the memory device to execute the write command.

Write parameter switching in a memory device

A memory device operable in an ultra-deep power-down mode can include: a command user interface; a voltage regulator having an output that provides a supply voltage for a plurality of components of the memory device, where the plurality of components comprises the command user interface; a wake-up circuit that remains powered on even when the memory device is in the ultra-deep power-down mode; the memory device being operable to enter the ultra-deep power-down mode in response to receiving a first predetermined command that causes the output of the voltage regulator to be disabled to completely power down the plurality of components during the ultra-deep power-down mode; and the memory device being operable to exit the ultra-deep power-down mode in response to receiving one of a hardware reset command sequence, a reset pin assertion, a power supply cycling, and a second predetermined command.

Memory device ultra-deep power-down mode exit control

A circuit can include a signal section that includes a first signal transistor configured to operate in a subthreshold region to maintain the signal node at about VCC as VCC rises from a low level; a high threshold section that enables a current path from the signal node to the low power supply node only after a voltage at the detect node exceeds a level greater than a threshold voltage (Vt); and an output section having transistors with relatively long channels, for reduced crowbar current.

Circuits and systems having low power power-on-reset and/or brown out detection

In one embodiment, a semiconductor memory device includes a plurality of resistive switching memory cells, where each resistive switching memory cell can include: (i) a programmable impedance element having an anode and a cathode; (ii) an access transistor having a drain coupled to a bit line, a source coupled to the programmable impedance element cathode, and a gate coupled to a word line; (iii) a well having a first diffusion region configured as the source, a second diffusion region configured as the drain, and a third diffusion region configured as a well contact; and (iv) a diode having a cathode at the second diffusion region, and an anode at the third diffusion region, where the diode is turned on during an erase operation on the programmable impedance element.

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San Jose, CA, United States of America

Nathan Gonzales