Isothermal Systems Research, Inc.

Nathan G Muoio

Tahir Cader

Charles Lester Tilton

Benjamin Hewett Tolman

A staggered spray nozzle system for efficiently thermally managing one or more electronic devices. The staggered spray nozzle system includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.

Staggered spray nozzle system

A method of operating a spray unit for efficiently thermally managing one or more electronic devices. The method of operating a spray unit includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.

Method of operating a spray unit

A method of controlling spray distances in a spray unit for efficiently thermally managing one or more electronic devices. The method of controlling spray distances in a spray unit includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.

Method of controlling spray distances in a spray unit

A dynamic thermal management spray system for efficiently thermally managing one or more electronic devices. The dynamic thermal management spray system includes one or more spray units having an adjustable spray characteristic. The spray characteristic of at least one spray unit is adjusted based upon the desired thermal management of one or more electronic devices. Adjusting the spray characteristic is preferably comprised of increasing/decreasing the fluid flow rate.

Dynamic thermal management spray system

A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.

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Pullman, WA, United States of America

Nathan G Muoio