Western Digital (fremont), Inc.

Nathan C Emley

Donghong Li

Prakash Mani

A motion sensing transducer includes an electrically conductive substrate having a major surface that defines a substrate plane, and a first compliant structure including a piezoelectric material and having greater compliance to inertial forces oriented out of the substrate plane than to inertial forces oriented in the substrate plane. The first compliant structure includes a piezoelectric material. The motion sensing transducer includes a second compliant structure having greater compliance to inertial forces oriented in the substrate plane than to inertial forces oriented out of the substrate plane. The second compliant structure includes a first surface that is electrically isolated from the substrate. The first surface faces a surface of the substrate. The motion sensing transducer includes a first electrically conductive lead that is electrically connected to the first surface, and a second electrically conductive lead that is electrically connected to the piezoelectric material.

Hybrid capacitive and piezoelectric motion sensing transducer

A method for fabricating a piezoelectric multilayer are described. The method includes providing conductive layers. Alternating conductive layers are electrically connected. A first plurality of alternating conductive layers is electrically isolated from a second plurality of alternating conductive layers. Piezoelectric layers are interleaved with the conductive layers. Apertures are provided in the piezoelectric layers. A first conductive plug electrically connects the first plurality of alternating conductive layers, includes a first plurality of segments, and is in apertures in the piezoelectric layers. Each of the first plurality of segments extends through one of the piezoelectric layers. A second conductive plug electrically connects the second plurality of alternating conductive layers, includes a second plurality of segments, and is in a second portion of the plurality of apertures. Each of the second plurality of segments extends through one of the plurality of piezoelectric layers.

Method for providing a piezoelectric multilayer

A novel head gimbal assembly (HGA) includes a piezoelectric microactuator having a first side and an opposing second side. The first side includes a plurality of anchor regions that extend radially from a center point and are bonded to the gimbal tongue. The first side also includes a first plurality of non-bonded regions lying between the anchor regions. The second side includes a plurality of link regions that extend radially from the center point and are bonded to a top surface of the read head. The second side also includes a second plurality of non-bonded regions lying between the link regions. Each of the plurality of link regions is angularly spaced between two of the plurality of anchor regions.

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San Francisco, CA, United States of America

Nathan C Emley