Qualcomm Mems Technologies, Inc.

Nassim Khonsari

Manish Kothari

Mark W Miles

Ion Bita

Gang Xu

Jonathan Charles Griffiths

Brian W Arbuckle

Patrick F Brinkley

Clarence Chui

Bangalore Ramaswamiengar Natarajan

Fritz Y F Su

A system and method for manufacturing a display device having an electrically connected front plate and back plate are disclosed. In one embodiment, the method comprises printing conductive raised contours onto a non-conductive back plate, aligning the back plate with a non-conductive front plate such that the raised contours align with conductive routings on the front plate to electrically connect the raised contours and the routings, and sealing the back plate and the front plate.

System and method of manufacturing an electromechanical device by printing raised conductive contours

A static interferometric image device including a plurality of solidified liquid layers is formed over a substrate by an inkjet process such that the layers are lateral to one another. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the solidified liquid layers are formed on the surface. Optical fillers or spacers are provided for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

Printable static interferometric images

Methods of fabricating a static interferometric image device and static interferometric image device formed by the same are disclosed. In one embodiment, a method includes providing a substrate. A plurality of liquid layers are formed over the substrate by an inkjet process such that the layers are lateral to one another. The liquid layers contain a solidifiable material or particles. Then, the plurality of liquid layers are solidified to form a plurality of solid layers. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the liquid layers are formed on the surface. The inkjet process provides optical fillers or spacers for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

A microelectromechanical systems device having a transparent substrate joined to a planar backplate with a raised perimeter structure forming a recessed cavity or cell. The raised perimeter structure is formed by applying a first layer around the peripheral area of the backplate to form a recessed cell. A second layer is applied over the first layer. The first layer is thicker than the second layer. The thicker layer comprises a viscous material. A second layer is a thinner adhesive layer, and is applied over the thicker layer to join the backplate to the transparent substrate to encapsulate the microelectromechanical systems device formed on the transparent substrate.

MEMS device having a recessed cavity and methods therefor

Methods for forming a MEMS display device are provided. In one embodiment, a transparent substrate comprising an array of MEMS devices (e.g., interferometric modulators) formed thereon is annealed following removal of a sacrificial silicon layer. The array is subsequently encapsulated with a backplate comprising a desiccant. MEMS devices disposed below the desiccant have an offset voltage substantially equal to zero.

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Redwood City, CA, United States of America

Nassim Khonsari