Flir Systems, Incorporated

Indigo Systems Corporation

Teledyne Flir Commercial Systems, Inc.

Flir Systems Ab

Teledyne Flir, LLC

Naseem Y Aziz

Brian B Simolon

William J Parrish

Robert F Cannata

Eric A Kurth

Nicholas Högasten

Theodore R Hoelter

Jeffrey Lynn Heath

Mark Nussmeier

Joseph Kostrzewa

John D Schlesselmann

Katrin Strandemar

Pierre M Boulanger

Barbara Sharp

James T Woolaway

Jonas Sandsten

Jeffrey Brian Barton

Nile E Fairfield

Henning Hagman

Sean Tauber

Marta Barenthin-Syberg

Jim Goodland

Hakan E Nygren

Randy J Hansen

Ulf Wallgren

Per Lilja

Adrienne N Costello

George H Poe

Glenn T Kincaid

Theodore B Hoelter

Techniques to test infrared detectors are disclosed. In one example, a focal plane array for an imaging system includes a plurality of infrared detectors arranged in a plurality of rows and columns where each of the infrared detectors is configured to provide an output signal in response to externally received thermal radiation associated with a scene. A plurality of offset circuits of the imaging system may be electrically coupled to the focal plane array and configured to selectively superimpose fixed-pattern noise on the output signals to provide modified output signals. A readout integrated circuit of the imaging system may be configured to provide the modified output signals for processing to test an integrity of the infrared detectors. Modified output signals that are outside an expected output range based on the thermal radiation and known offset may be determined defective. Related methods, devices, and systems are also provided.

Bolometer unit cell pixel integrity check systems and methods

Techniques for facilitating unit cell selection verification systems and methods are provided. In one example, a method includes detecting, by each detector of a focal plane array (FPA), electromagnetic radiation. Each detector is selectively coupled to a readout circuit of the FPA via a selection circuit of the FPA. The method further includes, during a frame period, applying a predetermined signal pattern to a portion of the selection circuit, where the portion is associated with a subset of detectors of the FPA, and performing a readout of the FPA to obtain a respective output signal associated with each respective detector of the FPA. The method further includes determining whether the portion of the selection circuit is operating properly based at least on the output signal associated with the detectors of the subset from the readout. Related systems and devices are also provided.

Unit cell selection verification systems and methods

An IR imaging device includes an optical element receiving infrared radiation from a scene, a filter blocking IR radiation outside of a particular range of wavelengths, an array of sensor pixels to capture an image of the scene based on infrared radiation received through the optical element and filter, the array of sensor pixels comprising a first array of sensor pixels to image gas in within a first spectral bandwidth, and a second array of sensor pixel to sense IR radiation in a second spectral bandwidth where gas is not detected, a read-out integrated circuit (ROIC) and logic circuitry to generate a first image sensed by the first array and a second image sensed by the second array, and gas detection logic to detect the presence of gas in the first image.

Gas imaging systems and methods

Techniques are disclosed for facilitating multiple microbolometer selection for simultaneous readout. In one example, a device includes a plurality of microbolometers. The plurality of microbolometers includes a first set and a second set of serially-connected microbolometers. The device further includes a first plurality of switches configured to selectively short the plurality of microbolometers. The device further includes a second plurality of switches configured to selectively couple the plurality of microbolometers to ground. The device further includes a third plurality of switches configured to selectively provide a bias signal to the plurality of microbolometers. The device further includes a processing circuit configured to configure the first plurality, second plurality, and third plurality of switches to cause simultaneous read out of one microbolometer of the first set and one microbolometer of the second set. Related methods and systems are also provided.

Multiple microbolometer selection for simultaneous readout

Techniques are disclosed for systems and methods for facilitating infrared imaging in multiple imaging modes. A device may include an infrared image capture circuit and at least one processing circuit. The infrared image capture circuit may be configured to detect first infrared data and generate a first pixel value based on the first infrared data and a first imaging mode among multiple imaging modes. The at least one processing circuit may be configured to compare the first pixel value to a set of saturation threshold values associated with the first imaging mode. The at least one processing circuit may be further configured to select an imaging mode among the multiple imaging modes based on the comparison of the first pixel value. The at least one processing circuit may be further configured to set the infrared image capture circuit to generate a second pixel value based on the selected imaging mode.

Infrared imaging in multiple imaging modes systems and methods

A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation. The bolometer circuit may be configured to reduce power consumption at high temperatures. In particular, the bolometer circuit may include additional resistors provided in the resistive loads for bolometer conduction paths to limit power at high temperatures. In some embodiments, the bias (e.g., a voltage level) to the gates of transistors in the resistive loads for the bolometer conduction paths may be adjusted based on temperature to limit power and/or current at high temperatures. In bolometer circuits with a feedback resistor provided across an amplifier to configure a feedback amplifier, a circuit with adjustable amplifier power may be provided to save power. In some embodiments, a bolometer circuits may be provided with reduced gains to allow for very hot scenes to be imaged without railing the output.

Low cost and high performance bolometer circuitry and methods

A bolometer circuit includes a substrate on which a focal plane array (FPA) of active bolometers is provided. Each active bolometer is configured to receive external infrared (IR) radiation and substantially thermally isolated from the substrate. The bolometer circuit also includes one or more blind arrays of blind bolometers shielded from the external IR radiation and substantially thermally isolated from the substrate. Noises in outputs from each column and/or each row of the FPA are corrected, reduced, or suppressed based on a statistical property of outputs from a corresponding column or row of the one or more blind arrays. Noise in each frame of IR image captured by the FPA may also be corrected, reduced, or suppressed using the one or more blind arrays.

Low cost and high performance bolometer circuity and methods

A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation and a resistive load, which are configured to be connected in series in a bolometer conduction path from a supply voltage node to a common voltage node. A node in the bolometer conduction path between the resistive load and the active bolometer is coupled to a first input of an op-amp. A variable voltage source is coupled to a second input of the op-amp to provide a reference voltage level. The op-amp maintains the reference voltage level at the first input to generate a current flow in response to a resistance change of the active bolometer due to the external IR radiation. The amplifier circuit may be configured as a feedback amplifier or an integrating amplifier. The bolometer circuit may be configured to enable a low-power mode of operation.

Various techniques are disclosed for bolometer circuits and related methods for thermal imaging in a difference domain, where each pixel value represents a difference in incident IR radiation intensity between adjacent bolometers. For example, a bolometer circuit may include an array of bolometers each configured to generate a pixel signal in response to a bias and incident infrared radiation. Each column of the bolometer array may comprise an amplifier, a first plurality of switches each configured to selectively provide a supply voltage to a respective one of bolometers of the each column, a second plurality of switches each configured to selectively route a difference of the pixel signals of a respective adjacent pair of the bolometers of the each column to an input of the amplifier, and a third plurality of switches configured to selectively provide a common voltage to a respective one of the bolometers of the each column.

Bolometer circuitry and methods for difference imaging

Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select a current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.

Abnormal clock rate detection in imaging sensor arrays

Techniques are disclosed to provide a reference signal via a switched capacitor filter for image detector arrays in accordance with one or more embodiments. For an example embodiment, a method of providing a sampled and filtered reference signal to an image detector array includes receiving a reference signal; sampling the reference signal with a first capacitor to store a sampled reference signal based on the reference signal; coupling a second capacitor to the first capacitor to share charge stored on the first and second capacitors to generate the sampled and filtered reference signal to store on the second capacitor; and decoupling the second capacitor from the first capacitor, wherein the sampled and filtered reference signal is stored on the second capacitor to provide for one or more image detectors within the image detector array.

Switched capacitor filter systems and methods

A microbolometer circuit includes, in accordance with an embodiment, a first microbolometer and a bias circuit, coupled to the first microbolometer, configured to provide a bias current to the first microbolometer to provide a first output signal based on a resistance of the first microbolometer. An output circuit, coupled to the bias circuit and the first microbolometer, is configured to provide an output signal based on the first output signal, wherein the bias circuit or the output circuit or both are configured to provide a varying signal level to compensate the first output signal for a change in the resistance of the first microbolometer due to the bias current increasing a temperature of the first microbolometer.

Microbolometer heating compensation systems and methods

Systems and methods for microbolometer focal plane arrays provide for the selection of microbolometers within the microbolometer focal plane arrays. In accordance with an embodiment, a microbolometer focal plane array includes a plurality of microbolometers forming a microbolometer array, wherein contacts within the microbolometer array are shared by the microbolometers; a first plurality of switches adapted to provide a voltage to respective ones of the plurality of microbolometers; a second plurality of switches adapted to receive an output signal from respective ones of the plurality of microbolometers; and a third plurality of switches adapted to selectively short respective ones of the plurality of microbolometers in the microbolometer array.

Systems and methods for selecting microbolometers within microbolometer focal plane arrays

Systems and methods for microbolometer focal plane arrays are disclosed. For example, in accordance with an embodiment of the present invention, microbolometer focal plane array circuitry is disclosed for a microbolometer array having shared contacts between adjacent microbolometers. Various techniques may be applied to compensate for non-uniformities, such as for example, to allow operation over a calibrated temperature range.

Microbolometer focal plane array systems and methods

Systems and methods are disclosed for measuring a distance (or gap) between substrates of a hybrid semiconductor. The measurements may be made during a hybridization process to, for example, provide alignment feedback during the hybridization process. The measurements may also be made after the hybridization process to further calibrate the process or to provide information useful for further processing operations.

Growing community of inventors

Goleta, CA, United States of America

Naseem Y Aziz