Tdk Corporation

Ifire IP Corporation

Naruki Kataoka

Masaki Takahashi

Yoshihiko Yano

Tomoyuki Oike

Akitoshi Yoshii

Takashi Aoki

Taisuke Ahiko

Tatsuya Kojima

Yukio Kawaguchi

Kazuyuki Hasebe

Tomohiro Sogabe

Akira Goshima

Keiko Kubo

A package includes a storage portion that stores an object to be stored, and a buffer portion that reduces a gap generated between the object to be stored and the storage portion. The storage portion includes a bottom and a lid facing the bottom, and the buffer portion includes a base facing the object to be stored in a stacking direction from the bottom toward the lid, a first fold, and a space adjusting portion connected to the base at the first fold. The space adjusting portion includes an adjusting region extending in the stacking direction, a plurality of second folds distributed in a first direction intersecting the first fold, and a contact region connected to the adjusting region at one of the plurality of second folds.

Package and buffer tool

A multilayer ceramic capacitor has an element body formed by alternately laminating a plurality of dielectric layers and a plurality of inner electrodes. On a substrate having a mounting surface provided with at least two lands, the multilayer ceramic capacitor is mounted such that the inner electrodes are parallel to the mounting surface. A multilayer ceramic capacitor mounting structure satisfies T/T&#x3e;0.1 and 300&#x2266;&#x3b5;&#x2266;2800, where T is the height of the multilayer ceramic capacitor, Tis the outer covering thickness of the element body, and &#x3b5;is the relative permittivity of the dielectric layers, and 0.6&#x2266;W/W&#x2266;1.0, where W is the width of the multilayer ceramic capacitor, and Wis the size of the land in a direction corresponding to the width of the multilayer ceramic capacitor.

Multilayer ceramic capacitor mounting structure and multilayer ceramic capacitor

An EL elementcomprises EL functional layerscomprising GaO:Eu between a thick film insulator layerand an upper electrodeprovided on a substrateon which a lower electrodewas formed and a light-emitting layercomprising MgGaOformed therebetween. The EL functional layershave the dual functions of insulating layers and electron doping layers. Due to this, the EL elementhas a low drive voltage and high light-emitting brightness, and the structure of the EL element is simplified.

EL functional film and EL element

A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.

Method for mounting chip component and circuit board

A sputtering target for fluorescent thin-film formation comprising a matrix material and a luminescent center material, wherein said matrix material has a chemical composition represented by the following formula (1), and simultaneously satisfies conditions represented by the following inequalities (2) to (5).MABOS&#x2003;&#x2003;(1)0.05&#x2266;&#x2266;5 &#x2003;&#x2003;(2)1&#x2266;&#x2266;6 &#x2003;&#x2003;(3)0.01&#x2266;/()&#x2266;0.85 &#x2003;&#x2003;(4)0.6&#x2266;(3/2)/()&#x2266;1.5 &#x2003;&#x2003;(5) wherein Mrepresents one or more elements selected from the group consisting of Zn, Cd and Hg, A represents one or more elements selected from the group consisting of Mg, Ca, Sr, Ba and rare earth elements, B represents one or more elements selected from the group consisting of Al, Ga and In, and v, x, y, z and w each represent numerical values satisfying the conditions specified in the inequalities (2) to (5).

Sputtering target for forming thin phosphor film

The present invention aims at realizing a phosphor thin film having a high luminance with a low emission threshold voltage, and an EL element comprising the same. The EL element of the present invention comprises a substrate, and a lower electrode, a lower buffer thin film containing a sulfide such as ZnS, a phosphor thin film containing an oxide such as a gallate as a matrix material, an upper buffer thin film containing a sulfide such as ZnS, and an upper electrode which are successively laminated on the substrate.

Growing community of inventors

Tokyo, Japan

Naruki Kataoka