Omron Corporation

Naru Yasuda

Hayami Hosokawa

Junichi Tanaka

Hiroto Nozawa

Hiroshi Sameshima

Akihiko Sano

Yukari Terakawa

Hironobu Kiyomoto

Kentaro Hamana

Toshiaki Okuno

Toshiyuki Takahashi

Masayoshi Higuchi

Akira Enami

Yoshiyuki Komura

Yoshihisa Ishida

Kazuyuki Hayamizu

Yoshitaka Tatara

Kenji Homma

Tatsuo Ohgaki

Kouhei Tomita

Hirokatsu Nakayama

Shinya Otsuki

Xiang Ruan

Tetsuya Nosaka

Fumihiko Sato

Ryo Yamamoto

Kouichi Ekawa

Akihiko Hatamura

Hiromi Totani

Yanping Lu

Takayoshi Koike

Shuichi Misuimi

Shingo Tamai

An object recognition device includes an acquisition unit configured to acquire a recognition target image that serves as an object to be recognized; a retrieval unit configured to search an image database storing a plurality of image data in association with tag information and retrieve a similar image that matches the recognition target image; and a recognition unit configured to recognize the object included in the recognition target image on the basis of tag information associated with a similar image obtained by the retrieval unit. The recognition may select the tag information that appears most frequently among the tag information associated with the similar images as a recognition result. The recognition unit may also compute a tag information reliability score from the similar image in the retrieval result and recognize an object taking into account said reliability score.

Object recognition device, object recognition method, and program for recognizing an object in an image based on tag information

A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H; wherein a relational expression H&#x3c;H&#x3c;His satisfied where the height His a distance in the normal line direction from the substrate surface to a surface of the light guide facing the substrate surface, and the height His a length in the normal line direction from the substrate surface in the light emitting/receiving element. The sealing resin is filled so as to cover the first and second sealing surface adjustment members and so as not to come in contact with the light transmission path.

Light transmission path package, light transmission module, electronic device and method for manufacturing light transmission module

An optical transmission module has an optical wiring for transmitting light, and an optical element for irradiating a light incidence plane of the optical wiring with light and a control circuit component for driving light emission of the optical element based on an externally input electric signal, or an optical element for receiving light emitted from a light emitting surface of the optical wiring and converting to an electric signal and a control circuit component for amplifying the electric signal output from the optical element and outputting to the outside. A plurality of boards overlapped and stacked so as to form a step with each other is arranged. A first board stacked at one end in a stacking direction of the plurality of boards is mounted with the optical wiring and the optical element so as to sandwich both surfaces in the stacking direction, and a board surface on the first board side of a second board stacked at another end is mounted with the control circuit component.

Optical transmission module, method for manufacturing optical transmission module, and electronic device

An optical module has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of the optical transmission path or a light incidence surface of the optical transmission path is arranged such that the optical element and the optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of the optical element. The optical element is sealed by a sealing agent. A gap is provided between the optical transmission path and the surface of the sealing agent on the light receiving surface or the light emitting surface of the optical element.

Optical module, method of producing optical module, optical transmission module, and electronic apparatus

An optical transmission module has an optical transmission path in which optical transmission is performed between a first circuit board and a second circuit board disposed opposite the first circuit board. The optical transmission path has a folded structure having a bending radius. A circumferential portion drawn by the bending radius is provided substantially perpendicular to board surfaces of the first circuit board and the second circuit board.

Optical transmission module, electronic instrument, method for assembling  optical transmission module, and optical transmission method

A serializer is equipped with a plurality of input terminals into which a plurality of binary signals are input in parallel, and converts the plurality of input binary signals into serial binary signals and transmits the serial binary signals to an optical transmission module. One input terminal out of the plurality of input terminals is assigned as an input terminal for preventing bit continuation by inserting '1' signals or '0' signals into the serial binary signals so that a predetermined number of bits of the same value may not be inserted continuously. Due to this structure, bit continuation can be prevented even for a signal generating source with no coding function by a simple configuration without increasing cost and size.

Parallel-serial converter for optical transmission, optical transmission system, and electronic apparatus

This invention provides an optical transmission module that is of low cost and that can be mounted even in a narrow space. An optical transmission module of the present invention includes a light reception processing section for converting an optical signal transmitted by an optical wiring to an electric signal, a reception side substrate part including an electric wiring for transmitting the electric signal, and a reception side connector section for providing the electric signal to the light reception processing section and the reception side substrate part. The light reception processing section and the reception side connector section are mounted on a same substrate surface of the reception side substrate part, and the reception side substrate part includes a bending portion bent so that the substrate surfaces oppose each other at the back in the normal direction.

Optical transmission module, electronic device, and method for manufacturing optical transmission module

A light transmission system has a light transmission module having a light transmission path that transmits a data signal as an optical signal, wherein the light transmission module converts the optical signal transmitted through the light transmission path to an electrical signal and outputs the converted optical signal as a binarization signal, an electrical transmission path that outputs a clock signal as a binarization signal, a reception processing unit that performs a reception process on each of the data signal and the clock signal, and a first delay unit that delays a rise start time of the clock signal with respect to a rise start time of the data signal for the binarization signal. A delay amount of the clock signal by the first delay unit is a time less than or equal to a maximum value of a data dependency jitter (DDJ).

Optical transmission system and electronic device using the same

In a package () formed by a supporting portion () for supporting a light emitting portion () or a light receiving portion () for emitting or receiving an optical signal, and a lid () for covering the supporting portion (); the supporting portion () or the lid () includes a light guide mounting surface () for supporting at least one end including an incident/exit port of the optical signal in a film light guide () for optically coupling with the light emitting portion () or the light receiving portion () and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface () from the light guide mounting surface () of the supporting portion () or the lid () to the lid () or the supporting portion () facing the light guide mounting surface () is longer than a length (d) in the Z-direction in a region of the film light guide () supported by the light guide mounting surface (). The light guide package having a structure in which the deformation and the damage of the core are less likely to occur even when subjected to impact by vibration and the like is thereby provided.

Film light guide package, film light guide module, and electronic device

An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.

Package manufacturing method, package, optical module and die for integral molding

A light transmission module includes a light transmission path for transmitting light, an optical element including a light emitting and receiving surface for optically coupling with the light transmitted by the light transmission path, and being formed with a light emitting and receiving point having a function of photoelectric conversion and an electrode pad on the light emitting and receiving surface. The light transmission module further includes a substrate mounted with the optical element and an electrical wiring and an electrical connecting member for electrically connecting the electrode pad and the electrical wiring. The substrate includes a wiring exposed surface where the electrical wiring is exposed. The electrical connecting member is made of solidified object of a liquid conductive material arranged to contact the electrical wiring, which is exposed at the wiring exposed surface, and the electrode pad.

Optical transmission module, electronic device and method for manufacturing optical transmission module

A connection member (), which electrically connects a package () on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide () that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate () to each other, is provided with a holding unit having elasticity, which holds the package (), and a connection unit that is connected to the substrate ().

Optical transmission module, connecting part, and electronic device having optical transmission module

An optical cable module is mainly provided with: an optical waveguide (), a light-receiving element () and a supporting substrate () at its end portion of the light releasing side. The end portion of the optical waveguide () is fixed in its relative positional relationship with the light-receiving element (). The end face of the optical waveguide () is not made perpendicular to the light axis (X-axis), and is diagonally cut so as to form an optical path conversion mirror (D). Assuming that a light ray (indicated by a solid line in the Figure) that passes through the center of the light-axis cross section of a core (A), and is reflected by the optical path conversion mirror (D), and then reaches a light-receiving face at a light axis reflection position, the center of the light-receiving element () is placed with a gap from the light axis reflection position, in the optical cable module ().

Optical cable module and apparatus using the same

An optical module () including a light receiving/emitting element () for transmitting or receiving an optical signal, an optical waveguide () having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element () and transmitting the optical signal, and a package () for accommodating at least one end including an entrance/exit port () of the optical signal in the optical waveguide () and the light receiving/emitting element (); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element () in the package () at the end of the optical waveguide () accommodated in the package () is configured by a first region including a portion projected into a space inside the package (), and a second region different from the first region; and the package () includes a supporting part () for supporting one part of at least one side of the surface forming the first region in the first region, and supporting one part of at least two sides of the surface forming the second region in the second region.

Optical module

An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent.

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Uji, Japan

Naru Yasuda