Daicel Corporation

Naritoshi Maetsu

Jun Watanabe

Takashi Konno

Shintarou Hatanaka

Provided is a composition capable of forming a cured product having excellent adhesion to a substrate, hardness, scratch resistance, and chemical resistance. The composition of the present disclosure includes a polyol compound (A) and an isocyanate compound (B), the polyol compound (A) containing a compound (a1) having a number average molecular weight calibrated with polystyrene standards of less than 800 and being represented by Formula (1), where Rto Rare a group represented by Formula (1a); and the isocyanate compound (B) containing a compound (b) represented by Formula (2), where Lto Lare a hydrogen atom, an NCO group, or an alkyl group having from 1 to 10 carbon atom(s) and having a group represented by Formula (2').

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Tokyo, Japan

Naritoshi Maetsu