Sumitomo Electric Industries, Limited

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

Sumitomo Electric Printed Circuits, Inc.

Narito Yagi

Masahiko Kanda

Hiroki Hirai

Masahiro Shibata

Satoshi Takano

Yoshio Oka

Noriki Hayashi

Atsushi Kimura

Kouji Ota

Kenji Miyazaki

Kazuyuki Maeda

Yoshitsugu Tsuji

Jinjoo Park

Kyouichirou Nakatsugi

Tetsuya Shimomura

Junichiro Nishikawa

Yoshitugu Tsuji

Toshiaki Sakai

The printed wiring boardincludes the metallic substrate, the insulating layerprovided on the surface of the metallic substrate, and the conductive layerformed on the surface of the insulating layer. The conductive layeris electrically connected to the metallic substrate. A bottomed via hole or a through holeis formed in the insulating layerand the conducive layer. The via hole has a bottom in the metallic substrate, and has a wall surface in the insulating layerand in the conductive layer. The through holeextends through the insulating layer, the conductive layer, and the metallic substrate. Conductive pastefills the bottomed via hole or the through holeto electrically connect the metallic substrateand the conductive layerwith each other. The printed wiring boardis subjected to a process in which current is applied to the interface between the metallic substrateand the conductive paste

Printed wiring board and method for manufacturing the same

A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 &#x3bc;m or less and the maximum particle diameter of which is 15 &#x3bc;m or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

Method for producing printed wiring board

An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc discharge wherein a voltage between the arc-resistant terminal and a second terminal immediately after separation thereof is DC36V to 60V and a current between terminals during contact is 6A to 30A. In another embodiment, the an electrical contact portion comprising at least 80 mass % of metal having a boiling point of not less than 1000 degrees centigrade. According to the present invention, since the electrical contact portion or the final contact portion of the terminal includes a specific metal-based material, even when the voltage applied between the terminals is increased and an arc discharge is liable to be generated, the arc discharge can be suppressed. The arc-resistant terminal of the present invention can be suitably used in a connector for an automobile, a joint box provided with the connector portion and the like. This abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile

Provided is a pair of arc discharge suppressive terminals electrically communicable with each other by engagement of the terminal pair. At least one of the terminal pair has a final contact site which is in contact with the counterpart terminal at a final stage of disengagement of the terminal pair. At least the final contact site is covered with an arc discharge suppressive layer containing a first metal having a melting point of 1,550&#xb0; C. or higher. It is preferable that the terminal pair contact with each other at a portion corresponding to a main contact site other than the arc discharge suppressive layer in a completely engaged state where the one of the terminal pair and the counterpart terminal are tightly engaged with each other. Preferably, the main contact site has a surface made of a material having a higher conductivity than the arc discharge suppressive layer. This arrangement effectively suppresses occurrence of arc discharge at a time of disengagement of the terminal pair.

Arc discharge suppressive terminal pair

Growing community of inventors

Osaka, Japan

Narito Yagi