Matsushita Electric Works, Ltd.

Panasonic Electric Works Co., Ltd.

Narimasa Iwamoto

Hiroaki Okada

Junji Imai

Shinya Murase

Nobuteru Maekawa

Teruaki Komatsu

Hiroyuki Inoue

Masayuki Sagawa

Michimasa Tsuzaki

Yuri Sakai

Takayuki Nakada

Tomohiro Yamaguchi

Hiroshi Suda

Yoshihiko Nakamura

Yasunori Matsui

Masahiro Matsumura

Hidetsugu Motobe

Tomonori Tanaka

Toshiyuki Yamauchi

Yukio Hatta

Shigekazu Azukizawa

Charged fine particulate water is provided, which has a nanometer particle size, for example, a particle size of 3 to 100 nm, and contains radicals such as hydroxyl radicals and superoxides. This charged fine particulate water can be generated by applying an electric-field intensity of 700 to 1200 V/mm between a pair of electrodes, while supplying water between the electrodes. By allowing the thus obtained charged fine particulate water to diffuse into an indoor space, it is possible to effectively remove bad odor components/bacteria from the indoor space.

Charged water particle, and method for creating environment where mist of charged water particle is dispersed

A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.

Thermoelectric module with interarray bridges

Thermoelectric module and a method of fabricating the same

An epoxy resin composition featured in containing, in a matrix of an epoxy resin having more than two epoxy groups in each molecule, a phenolic hardening agent having more than two phenolic hydroxyl groups in each molecule, an organobis(N-dialkylurea) hardening promotion agent, a solvent for the hardening promotion agent, and a guanamine compound, and capable of obtaining a prepreg excellent in the preservation stability and, less causing a solvency errosion (halo phenomenon) due to an infiltration of plating solution along boundaries between a printed copper circuit formed in an inner-layered circuit board and a resin forming the prepreg, is realized.

Prepreg of epoxy resin, hardener, and organodialkyurea promotor

Growing community of inventors

Nabari, Japan

Narimasa Iwamoto