Ips Corporation

Other

Naresh D Patel

Mark W Brown

Edward D Otremba

Rashid H Siddiqi

Mark D Brown

Novel low VOC solvent-based adhesives are provided, comprising a mixture of low vapor pressure, isomeric dimethyl-2-piperidones (DMPD) blended with (1) a non-solvent diluent, specifically, acetone (a VOC-exempt compound), or with mixtures of acetone and other known ketonic solvents such as methyl ethyl ketone (MEK), diethyl ketone (DEK), methyl propyl ketone (MPK), and methyl iso-butyl ketone (MIBK), cyclohexanone, and (2) thermoplastic PVC or CPVC resins. Omission of the resin provides a novel primer for pipes. The blended mixture yields PVC or CPVC pipe adhesives and primers that: (1) result in low VOC formulas (e.g., less than 510 g/l for PVC pipe and less than 490 g/l for CPVC pipe); (2) are very economical in the industry; (3) yield strong, quick setting, durable pipe joints that meet the required standards and performance criteria (e.g., ASTM D-2564 lap shear for PVC); (4) yield stable, low viscosity solutions that, in the case of adhesives, can be readily adjusted with thixotropes (e.g., Aerosil 200) to give desirable flow characteristics and body, as well as primers for solvent welding PVC and CPVC pipe and components; and (5) can be formulated with minimal (10 wt %) or no cyclic ethers such as THF.

Low VOC (volatile organic compounds), dimethyl-2-piperidone solvent-based, PVC and CPVC pipe and component adhesives and primers containing minimal or no tetrahydrofuran

CPVC adhesives for joining CPVC substrates, pipes and articles are provided which comprise (a) about 5 to about 25 wt. % CPVC resin, (b) about 20 to about 90 wt. % of a single pentanone or blends of pentanones, (c) 0 to about 20 wt. % total heterocyclic solvent, and (d) 0 to about 45 wt. % total of non-heterocyclic solvents other than component (b) (such as MEK, acetone, cyclohexanone, and so forth). The CPVC adhesive compositions of this invention permit a reduction in the content of heterocyclic solvents to be achieved while meeting performance standards applicable to CPVC pipe joining, such as hydrostatic burst strength and hydrostatic sustained pressure test.

Pentanone-based CPVC adhesives having reduced content of heterocyclic

An ABS adhesive for joining ABS articles, such as pipes, comprises: (a) about 10 to 35 wt% ABS resin; and (b) about 40 to 60 wt % dibasic esters and, optionally, at least one solvent selected from the group consisting of 0 to about 30 wt % methyl ethyl ketone and 0 to about 10 wt % acetone. The VOC level of the ABS adhesive composition of the invention is at or below the allowed maximum value of 350 g/l. The lap shear strength ranges from about 400 to 700 psi, which is deemed adequate for most non-pressure applications, such as drain, waste, and vent uses, and pool and spa applications.

Low VOC (volatile organic compound) primer for joining

A CPVC adhesive for joining CPVC pipes comprises: (a) about 18 to 28 wt % CPVC resin; (b) a high vapor pressure solvent comprising about 15 to 35 wt % tetrahydrofuran and 0 to about 30 wt % methyl ethyl ketone; and (c) a low vapor pressure solvent comprising about 20 to 45 wt % cyclohexanone, 0 to about 30 wt % N-methyl pyrrolidone, and 0 to 10 wt % dibasic esters (a mixture of refined dimethyl esters of adipic, glutaric, and succinic acids). The VOC level of the CPVC adhesive composition of the invention is at or below the allowed maximum value of 450 g/l, yet the adhesive meets or exceeds required performance standards, such as hydrostatic burst strength and hydrostatic sustained pressure test.

Low VOC (volatile organic compounds), solvent-based CPVC pipe adhesives

A PVC adhesive for joining PVC pipes comprises: (a) about 10 to 22 wt % PVC resin and about 2 to 25 wt % acrylic resin, the total of the PVC resin and acrylic resin ranging from about 18 to 35 wt % of said adhesive; (b) a high vapor pressure solvent comprising about 10 to 50 wt % tetrahydrofuran and 0 to about 40 wt % methyl ethyl ketone, with the total high vapor pressure solvent concentration not exceeding a maximum concentration of about 55 wt % of the total adhesive composition; and a low vapor pressure solvent comprising about 10 to 35 wt % cyclohexanone and 0 to about 35 wt % N-methyl pyrrolidone, with the total low vapor pressure solvent concentration at least about 19 wt % of the total adhesive composition. The VOC (volatile organic compound) level of the PVC adhesive composition of the invention is at or below the allowed maximum value of 450 g/l, yet the adhesive meets or exceeds required performance standards, such as lap shear strength.

Low VOC (volatile organic compounds), solvent-based PVC pipe adhesives

An ABS adhesive for joining ABS articles, such as pipes, comprises: (a) about 10 to 35 wt % ABS resin; and (b) about 40 to 60 wt % dibasic esters and, optionally, at least one solvent selected from the group consisting of 0 to about 30 wt % methyl ethyl ketone and 0 to about 10 wt % acetone. The VOC level of the ABS adhesive composition of the invention is at or below the allowed maximum value of 350 g/1. The lap shear strength ranges from about 400 to 700 psi, which is deemed adequate for most non-pressure applications, such as drain, waste, and vent uses, and pool and spa applications.

Low VOC (volatile organic compounds), solvent-based ABS adhesives

A low volatile organic compound emitting thermoplastic pipe adhesive includes a resin, one or more solvents, a low specific gravity filler such as hollow ceramic spheres and a thixotropic agent for maintaining the homogeneity of the adhesive mixture.

Low VOC (volatile organic compounds), solvent-based thermoplastic pipe

A method and apparatus for storing and preparing a two component reactive acrylic adhesive in which a liquid acrylic resin is mixed with an organic peroxide in solution without causing yellowing. A sealed container is used to house the peroxide solution and an inert gas, preferably nitrogen. The container is made from a translucent or transparent material to permit viewing during the mixing operation and is covered with an opaque material during storage of the peroxide solution and gas.

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Northridge, CA, United States of America

Naresh D Patel