Olin Corporation

Narendra N Singhdeo

Deepak Mahulikar

Michael J Pryor

Sheldon H Butt

Julius C Fister

Satyam C Cherukuri

Norman G Masse

Charles J Leedecke

The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.

Electronic packaging of components incorporating a ceramic-glass-metal

A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

Semiconductor die attach system

The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.

Products formed of a ceramic-glass-metal composite

A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.

Hermetically sealed package

The present invention is directed to a composite and process of forming the composite comprising metallic particles for enhancing the flow characteristics of said composite, a glass for adhering the composite together and the balance essentially ceramic particles. The composite has a matrix comprising the glass with the ceramic and metallic particles dispersed therein. The metallic particles are preferably present in the composite at a volume percentage so as to be discontinuously dispersed throughout.

Ceramic-glass-metal composite

A thermally conductive module is adapted for mounting a plurality of electronic components. A ceramic substrate has a first layer of foil glass bonded thereto and adapted for mounting a plurality of electronic components thereon. A second layer of foil is glass bonded to a second surface of the ceramic substrate and is adapted to conduct heat from the module.

Thermally conductive module

This invention relates to a laminated glass capacitor and method of making the capacitor. The capacitor is constructed of a plurality of internal electrodes stacked and having glass layers therebetween to give electrostatic capacity. External electrodes are connected to associated internal electrodes for taking out the electrostatic capacity. The glass layers are selected from a substantially pore free glass and the internal electrodes are formed of a metal foil selected from the group consisting of deoxidized copper alloy and oxygen free copper alloy.

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New Haven, CT, United States of America

Narendra N Singhdeo