Movaz Networks, Inc.

Narayanan Rajan

Steven L Garverick

Chien Hung Wu

Lucy Huang

Jun Guo

Jay S Mitchell

An array of electrostatically tiltable mirrors are formed in a MEMS structure. A first SOI wafer is etched to form an array of tiltable plates in the silicon device layer joined to the remainder of the wafer through pairs of torsion beams. A second SOI wafer is etched to form cavities corresponding to the tiltable plates. A ceramic multi-chip module (MCM) carrier is formed with multiple layers of wiring and electrodes corresponding to the tiltable plates. The two SOI wafers including their handle layers are bonded together. The handle layer of the second SOI is removed, and the bonded wafers are diced into chips. Each chip is bonded to a respective MCM carrier. Thereafter, the handle layer of the first SOI wafer is removed to release the tiltable mirror plates and the torsion beams. Electronic control chips may be bonded to the MCM carrier.

MEMS micro mirrors driven by electrodes fabricated on another substrate

A multiplexed analog control system for an micro electromechanical systems (MEMS) array of electrostatic actuators, such as tiltable mirrors in an optical switch. Each actuator includes a variable gap capacitor formed as part of the movable mechanical element. A hold capacitor is connected to each actuator capacitor, and a selectable high-voltage inverter connects them to provide a bipolar drive signal of 50% duty cycle. A single power digital controlled current source is connected to all the drive circuits to provide a high-power correction signal. Address decoders enable a selected one of the drive circuits to add or subtract the correction from the hold capacitor.

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Atlanta, GA, United States of America

Narayanan Rajan