Apple Inc.

Napthaneal Yuen Tan

Lucy Elizabeth Browning

Peter N Russell-Clarke

Tang Yew Tan

David A Pakula

Charles B Woodhull

Masashige Tatebe

Bryan Patrick Kiple

Thomas Johannessen

John Murray Thornton, Iii

Chien-Ming Huang

Julie Hanchak-Connors

Yu Yundi

John Patrick Ternus

Piotr S Trzaskos

Brian P Demers

Erik D Gillow

Donald Q Ross, Iii

Brian K Copeland

Shi Ze

Zhoujun Lu

Long Hin Lee

William S Masek

Lu Guojin

Lv Peng

John M Thornton

Yu Yifeng

Wu Chendong

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Double anodized parts

A metal part is surface treated using anodization and plating processes to produce different finishes on selective regions of the metal part. The different finishes can contrast in decorative appearance (such as color, shininess and texture) and structural properties (such as wear resistance).

Anodization and plating surface treatments

The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface thereon. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter is used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. The diamond cutter has a cutting edge and a land. The cutting edge cuts the surface of the part and the land burnishes the surface of the part to form a highly reflective and smooth surface. Thus, the diamond cutter cuts and burnishes portions of the part, thereby eliminating a subsequent polishing step.

Diamond cutting tools

Double anodizing processes

Electronic devices with reflective chamfer surfaces

The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter can be used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. In some embodiments, a complex feature having planar and curved surfaces is cut into a part.

Cutting tools for cutting curved and complex features

A method for machining may include providing a workpiece with a major (e.g., top) surface and an edge at a perimeter thereof. The method may also include providing a machining tool including an outer rotary cutter and an inner rotary cutter. The workpiece may be machined in a single pass of the machining tool around the perimeter thereof. Machining the workpiece may include simultaneously machining the edge with the inner rotary cutter and machining at least a portion of the major surface with the outer rotary cutter. Accordingly, the edge and at least a portion of the major surface of the workpiece may be simultaneously machined in a single pass. The inner rotary cutter may also simultaneously machine an undercut at the edge of the workpiece. A related machining apparatus including the machining tool is provided. Further, a computer readable medium may include program code for performing the above-described operations.

Method for machining and related machining tool, machining apparatus, and computer code

The embodiments described herein relate to methods, devices, and systems for masking a substrate using a photomasking process. An adaptive photomask configured to generate a photomasking pattern in accordance with dimensions of a surface feature on substrate is described. The adaptive photomask can be used to create customized photomask patterns for individual substrates. Methods and devices described herein can be used in manufacturing processes where similar parts having slight differences due to built-in tolerances are manufactured. Methods and a devices described herein can also be used in manufacture processes involving masking of three-dimensional portions of a part. A photomasking system that includes a translational mechanism for scanning a substrate surface is described.

Adaptive photomasks and methods for using the same

Methods for cutting smooth reflective surfaces

Growing community of inventors

San Jose, CA, United States of America

Napthaneal Yuen Tan