Kansai Paint Company, Ltd.

Sony Corporation

Mitsubishi Denki Kabushiki Kaisha

Naozumi Iwasawa

Osamu Isozaki

Hideo Kogure

Kenji Seko

Tadashi Watanabe

Genji Imai

Noboru Nakai

Ichiro Yoshihara

Junichi Higashi

Tsuguo Yamaoka

Toshio Kondo

Tetsu Maki

Toshiaki Nagano

Yuu Akaki

Takao Yamamoto

Heihachi Murase

Hiroshi Iwai

Sadaaki Hashimoto

Minoru Shibata

Shinsuke Onishi

Toshiro Hirama

Yukari Takeda

Motoko Okuhara

Yasuo Doi

Akira Tominaga

Keisuke Takuma

Koji Kamikado

Tsukasa Ohyama

Yoriaki Matsuzaki

Takeshi Tomiyama

Yasuo Takaya

Yasuyuki Hirata

Nobuo Komatsu

Tetsuo Ogawa

Kimitoshi Kato

Taizo Kondo

Susumu Midogochi

Yutaka Yoshikawa

Keisuke Naruse

Seigo Iwase

Isao Kobayashi

Kazuhiko Murayama

Susumu Kasamatsu

Satoshi Watanabe

Kazuhisa Koizumi

Yuw Akaki

Satoru Furusawa

Nami Konishi

Ikuyo Kai

Masahiro Hoshino

Nobuo Sugiyama

Yukio Suzuki

A method for forming an electrodeposition coating film, comprises a step of subjecting a steric metal article to be coated to electrodeposition coating, and a step of selectively heating/drying the resultant coating film by a plurality of induction heating devices.

Method for forming electrodeposition coating film

A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A') a hydroxy-phenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A'), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound. The positive type electrodeposition photoresist composition allows the forming of a fine image pattern at high resolution. A process for a resist pattern formation using such a composition is also disclosed.

Process for resist pattern formation using positive electrodeposition

A photosensitive composition which comprises, as essential components:

Processes for pattern formation using photosensitive compositions and

A positive type anionic electrodeposition photoresist composition comprising, as a main component, a dispersion obtained by neutralizing, with a base, a mixture comprising: (A) an acrylic resin containing carboxyl group(s) and hydroxyl group(s), (B) a vinylphenol resin containing a hydroxystyrene unit in an amount of at least 25% by weight based on the resin, and (C) an ester between a polyhydroxybenzophenone and 1,2-naphthoquinone diazide sulfonic acid or benzoquinone diazide sulfonic acid, and dispersing the resulting neutralization product in water. This composition is superior in running stability during electrodeposition and is useful for formation of highly reliable resist pattern or conductor pattern.

Positive type anionic electrodeposition photo-resist composition and

A photopolymerizable composition suitable as a solder resist and capable of forming a resist film having characteristics in no way inferior to those of the conventional heat-curable type or organic solvent developed type solder resist, with the use of water or a dilute aqueous solution which is completely innocuous and higher in safety than the aqueous alkaline solution, and a method for producing a cured coated film pattern using the photopolymerizable composition.

Water and acid developable photoresist composition exhibiting improved

The present invention provides a process for producing a high-density printed wiring board with plated throughholes, at high productivity and reliability by a direct drawing method. The process comprises making throughholes in a substrate having an electro-conductive layer on each side; conducting plating on at least the walls of the substrate throughholes; forming a photosensitive resist film on each side of the substrate; applying an actinic radiation onto the resist film by a direct drawing method in the shape of a pattern to be obtained when the resist film is a negative type, or in the shape of a pattern reverse to a pattern to be obtained when the resist film is a positive type; forming, on the uncoated portion inside the throughholes by electrodeposition, an electrodeposition film which is insoluble in a developing solution used later and an etching solution used later but is removable with a peeling solution used later; conducting development with an appropriate developing solution to remove the resist film; removing the exposed plating layer portion and the electro-conductive layer portion present therebeneath, by etching; and then peeling the remaining resist film and the electrodeposition film inside the throughholes, with an appropriate peeling solution.

Process for production of printed circuit board

A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A') a hydroxyphenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A'), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound. The positive type electrodeposition photoresist composition allows the forming of a fine image pattern at high resolution. A process for a resist pattern formation using such a composition is also disclosed.

Positive type electrodeposition photoresist compositions

A positive-type photosensitive electrodeposition coating composition comprising a water-soluble or water-dispersible resin having an ionic group and containing at least one modified quinonediazidesulfone unit represented by the following formula (I) or (II) ##STR1## wherein R.sub.1 represents ##STR2## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, and

Positive-type photosensitive electrodeposition coating composition and

A photosensitive composition which comprises, as essential components: (A) a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxyl group(s) and (A') a polymer having hydroxyphenyl group(s), (B) a compound having at least two vinyl ether groups in the molecule, and (C) a compound which generates an acid when irradiated with an actinic ray, and which is useful as a positive type photoresist having high resolution and excellent formability of fine image pattern, a material for printing, etc.; and a process for pattern formation using said composition.

Photosensitive compositions containing a polymer with carboxyl and

A resin composition comprising a) a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 3,000 to 200,000; b) a silane compound having an average of 1 or more alkoxysilane, silanol and acyloxysilane groups per molecule and having a number average molecular weight of 104 to 200,000; and c) a metal chelate compound, is curable at a relatively low temperature to yield a film having excellent resistance to weathering.

Resin compositions and a method of curing the same

An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic have reflecting metallic material layer, if needed, (B) a substrate layer, (C) a resin layer containing a powder of at least one selected from ferrite, carbon, metal powder and an electrically conductive metallic oxide, and, if needed, a good dielectric material, if needed, (D) a supporting film layer, and (E) a pattern coating layer prepared in the form of a geometrical pattern, containing a metal powder and having a volume resistivity of 10.sup.-3 to 10.sup.10 .OMEGA..multidot.cm, preferably further laminating (F) a clear or colored coating layer; and an electromagnetic wave reflection-preventing material which is obtained by substituting (G) a molded sheet layer formed by coating a coating composition prepared by dispersing the above powder into a binder onto a substrate having void, and molding under pressure for (C) a resin layer; and an electromagnetic wave reflection-preventing method which comprises applying the electromagnetic wave reflection-preventing material onto a structure, or which comprises applying a laminate obtained by removing the electromagnetic wave reflecting metallic material layer (A) from the electromagnetic wave reflection-preventing material onto an electromagnetic wave reflecting structure having a metallic surface.

Electromagnetic wave reflection-preventing material and electromagnetic

An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic wave reflecting material layer, if needed, (B) a supporting layer, (C) a resin layer, if needed, (D) a supporting layer, and (E) a metallic pattern layer prepared by arranging at least one of a pattern unit comprising a geometrical pattern formed by use of a continuous metallic band, or comprising a multi-figured structure formed by combining a plurality of band-shaped metallic figures so as not to contact with each other; and an electromagnetic wave reflection-preventing method by use of the electromagnetic wave reflection-preventing material.

An electromagnetic wave reflection-preventing material having a structure formed by a process which comprises successively laminating (A) a pattern layer formed in the form of a geometrical pattern having a volume resistivity of 10.sup.3 .OMEGA. . cm or less, if needed, (B) a supporting layer, (C) a resin layer, and, if needed, (D) a supporting layer, to form a laminate unit, laminating a pluralitry of the laminate unit so that the layer (A) may face on the layer (C) or (D) to form a multiple laminate unit structure, and laminating the multiple laminate unit structure onto (E) an electromagnetic wave reflecting material layer so that the layer (C) or (D) of the multiple laminate unit structure may face on the layer (E), preferably further laminating a clear or colored coating layer onto the uppermost metallic pattern layer of the electromagnetic wave, reflection-preventing material; and an electromagnetic wave reflection-preventing method which comprises applying the electromagnetic wave reflection-preventing material onto a structure, or which comprises applying the multiple laminate unit structure obtained by removing the electromagnetic wave reflecting material layer (E) from the electromagnetic wave reflection-preventing material onto an electromagnetic wave reflecting structure having a metallic surface.

Positive-type photosensitive electrodeposition coating composition

A positive-type photosensitive electrodeposition coating composition comprising (A) a photosensitive compound having a molecular weight of not more than 6,000 and containing at least one modified quinonediazidesulfone units represented by the following formula (I) ##STR1## wherein R.sub.1 represents ##STR2## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group,

Electrodeposition coating composition

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Hiratsuka, Japan

Naozumi Iwasawa