Fujitsu Corporation

Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Naoyuki Watanabe

Shigeyuki Maruyama

Daisuke Koizumi

Kazuhiro Tashiro

Toshiyuki Honda

Takafumi Hashitani

Ei Yano

Susumu Moriya

Izumi Kobayashi

Yoshito Akutagawa

Susumu Kida

Ichiro Midorikawa

Noboru Hayasaka

Eiji Yoshida

Toshimi Kawahara

Kenichi Nagashige

Yoshito Konno

Koichi Murata

Tetsuya Fujisawa

Naohisa Matsushita

Naohito Kohashi

Keisuke Fukuda

Takao Ohno

Osamu Igawa

Masayuki Imakado

Masahiko Ishiguri

Takumi Kumatabara

Hiroshi Nozawa

Akira Sawamori

Keiichi Sasamura

Kyohei Tamaki

A method for manufacturing a semiconductor device includes forming at least one stripe-shaped protection film over a multilayer film in a scribe region of a semiconductor substrate having a plurality of semiconductor element regions formed therein, the protection film having a thickness larger in a center portion thereof than at an end surface thereof and being made of a member which transmits a laser beam, and removing the multilayer film in the scribe region by irradiating the protection film with a laser beam.

Method for manufacturing semiconductor device, and semiconductor substrate

The storage body includes a tape formed with recess portions that dip in in a thickness direction formed at intervals along the tape length direction and a cover that is superimposed on the tape and closes off openings of the recess portions. The tape is fixed to the tape by intermediate fixing portions and a pair of side fixing portions. The intermediate fixing portions are formed between the mutually adjacent recess portions. The pair of side fixing portions include overlapping portions and connect portions. The overlapping portions are formed at the two tape width direction sides of the intermediate fixing portions so as to overlap with the intermediate fixing portions along the tape length direction. The connect portions are formed with constant width connecting together the respective overlapping portions disposed in lines along the tape length direction.

Storage body and reel

A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

Tray in combination with electronic component attaching tool attached to the tray

An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

Image pickup device and production method thereof

An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.

IC socket with attached electronic component

To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board, an image pickup devicemounted on the support board, and a lens componentprovided on the light receiving region of the image pickup device, wherein the lens componenthas a protrusion partprovided around the lens part, and the height of the protrusion partfrom the surface of image pickup deviceis greater than that of the topA of lens partfrom the surface of the image pickup device

Image pickup apparatus and method of manufacturing the same

A solid-state imaging device includes: a solid-state imaging element having a light-receiving area; a transparent member disposed so as to oppose the light-receiving area; a supporting member configured to support the transparent member; a first mark disposed at either an upper surface of the transparent member or an upper surface of the supporting member; and a second mark disposed at an outer side of the light-receiving area, at an upper surface of the solid-state imaging element.

Solid-state imaging device and method of fabricating solid-state imaging device

A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of the semiconductor element, and a shock-absorbing member provided between the edge surface of the transparent member and the sealing member and easing a stress which the transparent member receives from the sealing member or the semiconductor element.

Semiconductor device and manufacturing method of the same

A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Method of resin sealing electronic part

Semiconductor device having transparent member

An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

Image capturing device

An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Electronic component attaching tool

A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.

Growing community of inventors

Kawasaki, Japan

Naoyuki Watanabe