Ikeda Bussan Co. Ltd.

Fujitsu Corporation

Naoyuki Takada

Masanobu Hatanaka

Motoshu Miyajima

Shuichi Miyata

Hironobu Murakami

The present invention relates to a semiconductor device manufacturing method containing the step of polishing an insulating oxide film having an uneven surface, to improve a throughput in burying the insulating film into trenches and also improve flatness of a polished surface. The method comprises a step of forming a polishing stopping film,on a surface of a semiconductor substrate,, a step of forming trenches,to,by etching the semiconductor substrate,via the opening portions, a step of forming an insulating film,in the trenches,to,and on the semiconductor substrate,, and steps of first polishing the insulating film by using a first abrasive cloth,which has a polishing surface with first hardness while supplying a first slurry onto a polished surface of the insulating film,and then polishing the polished surface of the insulating oxide film,by using a second abrasive cloth,which has second hardness softer than the first hardness while supplying a second slurry onto the polished surface of the insulating film,until the polishing stopping film,is exposed.

Semiconductor device manufacturing method

A vehicular seat whose seat back is divided into upper and lower seat backs. The lower seat back is hingedly connected at its lower end section with a seat cushion and at its upper end section with the lower end section of the upper seat back. The upper end section of the lower seat back is slidably supported onto a back panel of a vehicle body through a bracket fixed to the back panel, so that the lower seat back upper end section is slidable along a guide opening formed in the bracket. The upper seat back is also slidably movable along the back panel, following the lower seat back.

Sliding seat bottom interconnected with back having hinged upper and

A seat for a vehicle which includes a seat belt, said seat including a seat cushion mounted on a longitudinal slide mechanism, a hinge arm pivotally mounted on a hinge bracket secured to a side of the seat cushion, and a seat back attached to the hinge arm, a pad material and a skin material for a side of the seat back being disposed outside an upper portion of the hinge arm, adjacent a tongue portion of the seat belt, and a seat belt tongue entrance-preventing member being provided outside an exposed portion of the hinge arm and extending downwardly from lower ends of the pad and skin materials at the side of the seat back having an entrance-preventing surface which projects outwardly from a surface of the skin material at the side of the seat back and which is curved toward a rear end of the hinge arm to deflect the seat belt tongue portion away from the seat as the seat cushion is moved rearwardly along the slide mechanism.

Growing community of inventors

Kanagawa, Japan

Naoyuki Takada