Tokyo Electron Limited

Fanuc Corporation

Naoyuki Suzuki

Tetsuya Miyashita

Shinji Orimoto

Naoki Watanabe

Tatsuo Hatano

Shinji Furukawa

Hiroshi Sone

Masamichi Hara

Manabu Nakagawasai

Koji Maeda

Hiroyuki Yokohara

Hiroshi Miki

Atsushi Gomi

Shunsuke Matsubara

Shinichi Horikoshi

Kiichi Inaba

Naoto Ota

Yasuyuki Matsumoto

Katsuo Kobari

Kaoru Yamamoto

Toshiharu Hirata

Junichi Takei

Yuji Kanamori

Hiroyuki Toshima

Tsutomu Shikagawa

Makoto Takeshita

Akira Hirai

Tatsuo Shinohara

Motoi Yamagata

Takuya Umise

Kouji Maeda

Yasuyuki Kagaya

Yuuki Motomura

Hideyuki Nakamura

A substrate transfer device, includes: a first planar motor installed in a first chamber and having an array of coils; a second planar motor installed in a second chamber connected to the first chamber and having an array of coils; a pair of transfer units configured to move on at least one of the first planar motor and the second planar motor and configured to transfer a substrate; and a controller configured to control supply of electric current to the coils of the first planar motor and the second planar motor.

Substrate transfer device and substrate processing system

A substrate transfer apparatus includes a planar motor provided in a transfer chamber and having coils arranged therein, a transfer unit movable on the planar motor, and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.

Substrate transfer apparatus and substrate processing system

The substrate transfer apparatus includes a planar motor provided in a transfer chamber and having coils arranged therein; a transfer unit movable on the planar motor; and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.

A temperature measuring device that measures a temperature of a rotatable stage that holds a substrate, includes: a contact portion provided at a position that does not hinder placing of the substrate on the stage, and a temperature detector having a temperature sensor, and provided at a position separated from the temperature detection contact portion except when measuring a temperature. When measuring the temperature of the stage, the temperature detection contact portion and the temperature detector are relatively moved and brought into contact with each other in a state where the stage is not rotating to detect the temperature of the stage.

Temperature measuring mechanism, temperature measuring method, and stage device

A sputtering device includes a processing chamber where a substrate is accommodated, and a slit plate that partitions the processing chamber into a first space where a target member is disposed and a second space where the substrate is disposed. The slit plate includes an inner member having an opening that penetrates therethrough in a thickness direction of the slit plate, and an outer member disposed around the inner member. The inner member is attachable to and detachable from the outer member.

Sputtering device

A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body, and cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage. The stage device further includes a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.

Stage device and processing apparatus

A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a chiller having a cold head maintained at an extremely low temperature and a cold heat transfer body fixed in contact with the cold head and disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body. The stage device further includes a heat insulating structure unit having a vacuum insulated structure and configured to surround at least the cold head and a connection portion between the cold head and the cold heat transfer body, cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage, and a stage support rotated by a driving mechanism and configured to rotatably support the stage.

There is provided a stage mechanism, including: an electrostatic chuck having a conductive film formed on a front surface thereof, the conductive film configured to make electrically contact with a rear surface of a substrate; a conductive member electrically connected to the conductive film and formed to extend to a rear surface of the electrostatic chuck; and a moving member electrically connected to the conductive member via a connecting member and configured to move between a first position connected to a ground potential and a second position not connected to the ground potential.

Stage mechanism, processing apparatus, and method of operating the stage mechanism

There is provided a method of forming an insulating film which includes providing a workpiece having a base portion and a protuberance portion formed to protrude from the base portion; and forming an insulating film on the workpiece by sputtering. The forming an insulating film includes forming the insulating film while changing an angle defined between the workpiece and a target.

Method of forming later insulating films for MTJ

An apparatus includes a row of substrate transfer deviceswhich can deliver a wafer W within a transfer chamber; and rows of process modules PM, arranged at right and left sides of the row of the substrate transfer devices along the row, configured to perform processes to the wafer W. The rows of the process modules PM are arranged such that each of the processes can be performed by at least two process modules PM. Thus, when a single process module PM cannot be used, the wafer W can be rapidly transferred to another process module PM which can perform the same process as performed in the corresponding process module. Therefore, even when the single process module PM cannot be used, the processes can be continued to the wafers W without stopping an operation of the apparatus, so that the number of wasted wafers W can be reduced.

Substrate processing apparatus

A film forming apparatus includes: a chamber main body defining a chamber; a slit plate partitioning the chamber into a first space and a second space below the first space, the slit plate having a slit penetrating therethrough; a holder holding a target in the first space; a stage for supporting a substrate, the stage being movable in a moving direction perpendicular to a longitudinal direction of the slit in a moving area including an area directly below the slit; and a mechanism for moving the stage along the moving direction. In order to suppress scattering of particles from the target to another area other than the moving area in the second space through the slit, the stage has one or more protruding portions which provide upwardly and/or downwardly bent portions in a path around the stage between the slit and the another area in the second space.

Film forming apparatus

In a processing apparatus according to one embodiment, a stage is installed inside a process chamber. The stage has a plurality of through-holes formed therein, which corresponds to a plurality of lift pins. The plurality of lift pins is supported by a spline shaft through a support body. The spline shaft is supported by a spline bearing such that the spline shaft is vertically moved. The plurality of lift pins is biased upward by a spring member through the spline shaft. The spline shaft, the spline bearing, and the spring member are installed in an outer space separated from a depressurizable inner space of the process chamber.

Apparatus of processing workpiece in depressurized space

A fixing unit fixes a plate-shaped member to a fixing base member. The fixing unit includes: a pressing unit configured to press the plate-shaped member toward the fixing base member; and a plurality of positioning units, installed at the fixing base member to be in contact with side surfaces of the plate-shaped member, and configured to place the plate-shaped member with respect to the fixing base member. Each of the positioning units includes: a shaft to be installed at the fixing base member; and a slide part movable along the shaft, and the slide part includes a contact part to be in contact with one of the side surfaces of the plate-shaped member and a clearance part formed on the contact part to have a smaller width than that of the contact part.

Fixing unit of plate-shaped member, PVD processing apparatus and fixing method of plate-shaped member

There is provided a method for performing a pre-treatment to form a copper wiring in a recess formed in a substrate, which includes forming a barrier layer on a surface of the substrate that defines the recess, and forming a seed layer on the barrier layer. The method further includes at least one of etching the barrier layer and etching the seed layer. In the at least one of etching the barrier layer and etching the seed layer, the substrate is inclined with respect to an irradiation direction of ions while rotating the substrate.

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Yamanashi, Japan

Naoyuki Suzuki