Ibiden Company Limited

Naoyuki Jimbo

Shigeharu Ishikawa

Yuji Okuda

Atsushi Mishima

Masahiro Tsuji

Hideki Takagi

Hiroyuki Yasuda

Kazutaka Majima

A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table () includes a plurality of superimposed bases () each of which is formed of silicide ceramic or carbide ceramic. The bases () are joined together by an adhesive layer (). A fluid passage () is formed in a joining interface between the bases ().

Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer

A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

Wafer holding plate for wafer grinding apparatus and method for manufacturing the same

A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

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Gifu-ken, Japan

Naoyuki Jimbo