Dai Nippon Printing Co., Ltd.

Hitachi, Ltd.

Hitachi-High-Technologies Corporation

Naoya Takeuchi

Yoshihiko Suzuki

Tomohiro Yonemoto

Shunji Maeda

Hiroshi Goto

Kaoru Sakai

Takafumi Okabe

Shin Yamada

Hiroshi Kishimoto

Masayuki Kuwabara

Kasumi Oi

Taeko Kanamori

Koki Akutsu

Tsutomu Noto

Taeko Matsushita

The present invention provides: a sealant film for packaging liquid contents, which is excellent in manufacture suitability, exhibits the effect of being highly adsorptive against an eluting organic substance that a packaging material inherently contains, and odors generated by decomposition of a package-constituting resin and the like, at the time of sterilization/disinfection treatment, and is excellent in resistance to an odor-taste change for the liquid contents; and a package for liquid contents, produced using the sealant film. A sealant film for packaging liquid contents includes at least an odor adsorption layer, wherein the sealant film is formed from a resin composition containing low-elution polyethylene, the odor adsorption layer is formed from a resin composition containing the low-elution polyethylene and an odor adsorbent, a concentration of eluting TOC contained in a film formed from the low-elution polyethylene is 1.5 ppm or higher and 250 ppm or lower, and the odor adsorbent is an inorganic porous material carrying a chemical adsorbent thereon; and a packaging material for liquid contents and a package for liquid contents are produced using the sealant film.

Sealant film for packaging liquid contents, laminate including same, packaging material for liquid contents, and package for liquid contents

An object of the present invention is to provide a resin composition for an odor-adsorbing molded article that is excellent in manufacturability, eliminates odor by exerting a high adsorbing effect on odorous organic matter originally contained in packaging materials and odor generated by the decomposition, etc. of resins constituting packages during disinfection/sterilization treatment such as UV irradiation, hot packing, boiling, &#x3b3; ray irradiation, or EB irradiation, is less likely to desorb the odor once adsorbed and capable of efficiently adsorbing odor and therefore exerts a high adsorbing effect over a long period without reducing the ability to adsorb odor, and is excellent in resistance to change in taste and odor of contents, and an odor-adsorbing molded article prepared from the resin composition for an odor-adsorbing molded article. The present invention provides a resin composition for an odor-adsorbing molded article comprising at least thermoplastic resin A and an odor adsorbent material, wherein the odor adsorbent material comprises hydrophobic zeolite having a SiO/AlOmolar ratio of 30/1 to 8000/1, and a melt flow rate of the thermoplastic resin A is 5 g/min or more and 100 g/min or less, and an odor-adsorbing molded article prepared from the resin composition for an odor-adsorbing molded article.

Odor-adsorbing molded article resin composition, odor-adsorbing molded article, and packaging material

To provide a PTP blister sheet exhibiting a high adsorption effect over prolonged periods, and a PTP blister pack formed from it. A PTP blister sheet having at least a gas barrier layer and an odor adsorption layer, wherein the odor adsorption layer comprises a heat-sealable resin containing an odor adsorption agent, and the odor adsorption agent is formed by a chemical adsorption agent supported on an inorganic porous body, and a PTP blister pack formed from it.

PTP blister sheet, and PTP blister pack formed from same

Provided is a hygroscopic packaging container which eliminates the necessity of filling a moisture absorbent and which has satisfactory working efficiency and is highly effective in moisture absorption. The hygroscopic packaging container is obtained from two gas-barrier multilayer films each comprising a gas-barrier layer and a heat-sealable layer, by stacking the gas-barrier multilayer films so that the surface of one of the heat-sealable layers overlies that of the other and heat-sealing the peripheral parts of the layers, at least one heat-sealable layer of the two gas-barrier multilayer films being a hygroscopic heat-sealable layer.

Hygroscopic packaging container

The conductive porous layer for batteries according to the present invention comprises a laminate comprising a first conductive layer and a second conductive layer. The first conductive layer includes at least a conductive carbon material and a polymer. The second conductive layer includes at least a conductive carbon material and a polymer. The conductive porous layer satisfies at least one of the following two conditions: 'the polymer in the first conductive layer is present with a high density at the surface of the layer in contact with the second conductive layer than at the surface not in contact with the second conductive layer' and 'the polymer in the second conductive layer is present with a higher density at the surface of the layer in contact with the first conductive layer than at the surface not in contact with the first conductive layer.' This makes it possible to provide a conductive porous layer with good adhesion between the first conductive layer and the second conductive layer and with reduced film thickness variation in each conductive layer. The conductive porous layer of the present invention can be used for fuel cells, metal-air batteries, and the like.

Conductive porous layer for batteries and fabrication method for same

The conductive porous layer for batteries according to the present invention comprises a laminate comprising a first conductive layer and a second conductive layer. The first conductive layer includes at least a conductive carbon material and a polymer. The second conductive layer includes at least a conductive carbon material and a polymer. The conductive porous layer satisfies at least one of the following two conditions: 'the polymer in the first conductive layer is present with a high density at the surface of the layer in contact with the second conductive layer than at the surface not in contact with the second conductive layer' and 'the polymer in the second conductive layer is present with a higher density at the surface of the layer in contact with the first conductive layer than at the surface not in contact with the first conductive layer.'

A pattern inspection method including: sequentially imaging plural chip formed on a substrate; selecting at least one of pattern sections of each inspection image obtained by the imaging, while discarding other pattern sections, based on a recipe created in advance, the recipe including information for determining which pattern sections to be selected or discarded; calculating position gap between an inspection image of a chip obtained by the imaging and a reference image stored in a memory by using positional information of pattern images included in the inspection image and reference pattern images which are both corresponding to the at least one of pattern sections selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image, and extracting a difference between the two images as a defect candidate.

Pattern inspection method and its apparatus

A pattern inspection method including: sequentially imaging plural chips formed on a substrate; selecting a pattern which is suitable for calculating position gap between an inspection image of a subject chip and reference image stored in memory from an image of a firstly imaged chip among said sequentially imaged plural chips formed on the substrate; computing position gap between an inspection image of a chip obtained by the sequential imaging and reference image stored in a memory by using a positional information of a pattern image included in the inspection image and a reference pattern image included in the reference image which are both corresponding to the pattern selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image and extracting a difference as a defect candidate.

Growing community of inventors

Tokyo, Japan

Naoya Takeuchi