Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Naoya Takai

Yoshio Noguchi

Kazuki Tanaka

Mami Fujihara

Keita Saito

Mami Yamamoto

Yukihiro Takifuji

Takenori Yasuzumi

Eiji Nakashima

Tsuyoshi Tokiwa

A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

Semiconductor relay device

A photocoupler of an embodiment includes an input terminal, an output terminal, a first MOSFET, a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, and a resin layer. The first MOSFET is joined onto the third lead. The second MOSFET is joined onto the fourth lead. The semiconductor light receiving element is joined to each of the first junction region and the second junction region. The semiconductor light receiving element includes a light receiving region provided in a central part of a surface on opposite side from a surface joined to the first and second MOSFET. The resin layer seals the first and second MOSFETs, the semiconductor light receiving element, the semiconductor light emitting element, an upper surface and a side surface of the input terminal, and an upper surface and a side surface of the output terminal.

Photocoupler

An optical coupling device includes a light receiving element including a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element includes a first main terminal connected to the first output terminal, a first control terminal connected to the second output terminal, and a second main terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element. A lower surface of the first electrode plate is exposed on a lower surface of the sealing member. The lower surface of the first electrode plate and the lower surface of the sealing member form the same plane.

Optical coupling device

An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

Optical coupling device and high frequency device

A photocoupler of an embodiment includes a packaging member, a first and a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, a first wiring part, and a sealing resin layer. The input terminal includes a first and a second lead. The output terminal includes a third and a fourth lead. The first conductive region includes a signal input part and a bend part. The fourth conductive region includes a signal input part and a bend part. The semiconductor light receiving element is joined to the first and second MOSFETs astride a gap part. The semiconductor light emitting element is joined onto a light receiving region. The first wiring part connects the source electrode of the first MOSFET and the source electrode of the second MOSFET.

Photocoupler and packaging member thereof

According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.

Semiconductor device and optical coupling device

An optical coupler device includes, on a substrate, a first light-receiving element coupled to a first light-emitting element and a second light-receiving element coupled to a second light-emitting element. First, second, and third terminals are disposed on the first substrate. A first transistor pair and a second transistor pair are disposed on the first substrate. The first transistor pair is configured to electrically connect and disconnect the first and second terminals in response to a first light signal received by the first light-receiving element. The second transistor pair is configured to electrically connect and disconnect the second and third terminals in response to a second light signal received by the second light-receiving element.

According to one embodiment, a photocoupler includes a light emitting element, a light receiving element, a bonding layer, input terminals, output terminals and a molded resin body. A light emitting element includes a transparent support substrate, a semiconductor stacked body, and first and second electrodes. A light receiving element includes a light reception surface, a first electrode, and a second electrode. A bonding layer is configured to bond the first surface of the support substrate to the light reception surface side of the light receiving element. The bonding layer is transparent and insulative. Input terminals are connected to the first and second electrodes of the light emitting element. Output terminals are connected to the first and second electrodes of the light receiving element. The light reception surface is included in the light emitting surface. An input electrical signal is converted into an output electrical signal.

A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.

Growing community of inventors

Yukuhashi Fukuoka, Japan

Naoya Takai