Showa Denko Materials Co., Ltd.

Resonac Corporation

Epoch Company, Ltd.

Intelligent Wave, Inc.

Naoya Suzuki

Hiroshi Takahashi

Ryo Hasegawa

Aya Kasahara

Daisuke Fujimoto

Masaki Tsuji

Kumpei Yamada

Shizu Fukuzumi

Toshihisa Nonaka

Hitoshi Onozeki

Tomofumi Koyama

Masahiro Kawaragi

Takuya Kurakake

Keiichiro Katsuta

Yuta Koseki

A method for manufacturing a semiconductor package, the method includes: (A) forming a temporary fixing material layer on the first surface (circuit exposed surface) of a panel member including a plurality of semiconductor packages, (B) attaching an adhesive film to the second surface of the panel member; (C) singulating the panel member and the temporary fixing material layer on the adhesive film to obtain a plurality of temporary fixing material piece-attached semiconductor packages; (D) arranging a plurality of the temporary fixing material piece-attached semiconductor packages on a support carrier so that the distance between the adjacent temporary fixing material piece-attached semiconductor packages is 0.1 mm or more; (E) peeling off the first adhesive film from the support carrier and the plurality of temporary fixing material piece-attached semiconductor packages; and (F) forming a functional layer on surfaces of the plurality of temporary fixing material piece-attached semiconductor packages.

Production method for semiconductor packages

A packet flow monitoring device, a packet data extraction device, an extraction data aggregation device, and a program for efficiently and highly accurately monitoring a packet flow in a video or audio communication system constructed by an Ethernet (registered trademark) frame or IP packet network. This packet flow monitoring device includes: a packet data extraction device that replicates all passing packets that pass through one or a plurality of specific network switches on the network and extracts and aggregates some predetermined pieces of information in the replicated passing packets to form and output an extraction data report packet; and an extraction data aggregation device that receives the extraction data report packet, analyzes the extraction data report packet so as to aggregate the predetermined pieces of information in the replicated passing packets included in the extraction data report packet for each packet flow, and records the aggregated information as aggregation data.

Packet flow monitoring device, packet data extraction device, extraction data aggregation device, and program

Provided is a semiconductor element mounting structure, including: a semiconductor element including an element electrode, and a substrate including a substrate electrode that is provided on a surface facing the semiconductor element at a position facing the element electrode, the semiconductor element and the substrate being connected via the element electrode and the substrate electrode, in which: one of the element electrode or the substrate electrode is a first protruding electrode including a solder layer at a tip portion thereof, the other of the element electrode or the substrate electrode is a first electrode pad including one or more metal protrusions on a surface thereof, the one or more metal protrusions of the first electrode pad extend into the solder layer of the first protruding electrode, and a bottom area of each of the one or more metal protrusions of the first electrode pad is 70% or less with respect to an area of the first electrode pad, or 75% or less with respect to a maximum cross-sectional area of the solder layer of the first protruding electrode.

Semiconductor element mounting structure, and combination of semiconductor element and substrate

A method for producing a semiconductor device of the present invention includes: step (I) of disposing one or more semiconductor elements each having an active surface, on a thermosetting resin film containing a thermosetting resin composition, such that the thermosetting resin film and the active surfaces of the semiconductor elements come into contact; step (II) of encapsulating the semiconductor elements disposed on the thermosetting resin film with a member for semiconductor encapsulation; step (III) of providing openings in the thermosetting resin film or a cured product thereof after step (II), the openings extending to the active surfaces of the semiconductor elements; and step (IV) of filling the openings with a conductor or forming a conductor layer inside the openings.

Method for producing semiconductor device

Game device

Growing community of inventors

Tokyo, Japan

Naoya Suzuki