Fujifilm Corporation

Naoya Sugimoto

Kunihiko Kodama

Kenichiro Sato

Kei Yamamoto

Hyou Takahashi

A positive photosensitive composition includes: a resin (A) whose dissolution rate in an alkaline developing solution increases by the action of an acid, the resin (A) containing an acid decomposable repeating unit represented by a general formula (I) and an acid nondecomposable repeating unit represented by a general formula (II); and a compound (B) capable of generating an acid upon irradiation with one of active rays and radiations: wherein Xarepresents one of a hydrogen atom, an alkyl group, a cyano group, and a halogen atom, Arepresents one of a single bond and a divalent connecting group, ALG represents an acid leaving hydrocarbon group, Xarepresents one of a hydrogen atom, an alkyl group, a cyano group, and a halogen atom, Arepresents one of a single bond and a divalent connecting group, and ACG represents an acid nonleaving hydrocarbon group.

Positive photosensitive composition and method of forming pattern using the same

A photosensitive resin composition includes (a) a resin comprising a repeating unit represented by a following formula (1); (b) a photosensitive agent; (c) a thermo-acid generator; and (d) a compound having at least one of an alkoxymethyl group and an acyloxymethyl group, wherein Rrepresents a divalent to octavalent organic group containing 2 or more carbon atoms, Rrepresents a divalent to hexavalent organic group containing 2 or more carbon atoms, each of Rand Rindependently represents a hydrogen atom or an organic group containing 1 to 20 carbon atoms, m represents an integer of 0 to 2, and each of p and q represents an integer of 0 to 4, provided that p+q&#x3e;0.

Photosensitive composition, and cured relief pattern production method and semiconductor device using the same

According to the present invention, there is provided: a photosensitive resin composition comprising a polyamide resin having a specific structure, a photosensitive agent, and a compound having at least two sulfonate ester groups; a production method for a cured relief pattern using the photosensitive resin composition; and a semiconductor device containing the cured relief pattern formed according to the production method.

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Shizuoka, Japan

Naoya Sugimoto