Sanyo Electric Co., Ltd.

Naoya Sotani

Kiyoshi Yoneda

Yoshihiro Morimoto

Toshifumi Yamaji

Kiichi Hirano

Isao Hasegawa

Daisuke Ide

Yukihiro Noguchi

Yoichiro Aya

Yoshio Miyai

Shoichiro Matsumoto

Koji Suzuki

Hiroki Hamada

Yoshiyuki Ishizuka

Hisashi Abe

Yasuo Nakahara

Yasutaka Kobayashi

Tomoyuki Nouda

A display capable of inhibiting a transistor from an instable operation resulting from fluctuation of the potential of a shielding film and suppressing occurrence of a malfunction is provided. This display comprises a first region including a first transistor, a first shielding film provided on the first region, arranged on a region corresponding to the first transistor and supplied with a first potential, a second region including a second transistor and a second shielding film provided on the second region, arranged on a region corresponding to the second transistor and supplied with a second potential.

Display capable of inhibiting instable operation of a transitor resulting from fluctuation of the potential of a corresponding shielding film

A method of fabricating a thin film transistor by setting the temperature of a heat treatment for crystallizing an active layer which is formed on a substrate at a level not deforming the substrate and activating an impurity layer in a heat treatment method different from that employed for the heat treatment, and a semiconductor device prepared by forming a heat absorption film, a semiconductor film, a gate insulating film, and a gate electrode on a substrate, the heat absorption film being provided within a region substantially corresponding to the semiconductor film.

Semiconductor device, display device and method of fabricating the same

A layered structure of wire(s) comprising a wiring layer made of a low resistance metal containing aluminum, copper or silver; and an alloy layer made of an intermediate phase containing the low resistance metal and a refractory metal. The refractory metal is molybdenum. There is also formed a layered structure of wire(s) made of an aluminum alloy containing a lanthanoid, wherein a number average crystal grain size is 16.9 nm or more. Crystal grain size may be larger than a mean free path of electrons to provide a layered structure of wire(s) with a reduced resistance.

Aluminum alloyed layered structure for an optical device

A method of fabricating a semiconductor device capable of obtaining a high-density laser beam necessary for crystallizing a semiconductor layer or activating an impurity while miniaturizing a lens group provided on the outlet of an optical fiber member is provided. This method of fabricating a semiconductor device comprises steps of connecting a laser oscillator oscillating a near infrared laser beam and an irradiation optical system with each other through an optical fiber member having a single core part and heating a semiconductor layer by irradiating the near infrared laser beam from the irradiation optical system.

Method of fabricating semiconductor device and system of fabricating semiconductor device

A deposition mask capable of relaxing nonuniformity of the thickness of a deposit formed on a substrate and reducing the width of a non-opening part of a mask layer by reducing the thickness of the mask layer is obtained. This deposition mask comprises a mask layer formed by a single silicon thin film and a mask pattern, formed on the mask layer, including a mask opening having an opening width increased toward a deposition source. The mask layer formed by a silicon thin film can be reduced in thickness due to small deflection caused by its own weight. Thus, the width of the non-opening part of the mask layer can be reduced, whereby the width of a part formed with no deposit can be reduced. The mask opening having the opening width increased toward the deposition source reduces the probability of deposit particles, obliquely scattered from the deposition source, hitting an end of the mask opening, whereby the deposit is prevented from being reduced in thickness on an end corresponding to the end of the mask opening as well as from nonuniformity of the thickness.

Deposition mask and method of preparing the same

A method of fabricating a semiconductor device capable of improving productivity by efficiently polycrystallizing an amorphous silicon film is obtained. This method of fabricating a semiconductor device comprises steps of forming an amorphous film on a substrate, forming a conductor film on the substrate, arranging the substrate so that the surface of the conductor film is substantially parallel to an electric field in a waveguide and irradiating the conductor film with an electromagnetic wave thereby making the conductor film generate heat and crystallizing the amorphous film with the heat. Thus, the substrate is arranged to be substantially parallel to the electric field in the waveguide, whereby the absorptivity of the conductor film for the electromagnetic wave is improved and hence the conductor film can be efficiently heated. Thus, crystallization is performed in a short time, thereby improving productivity. The amorphous film is indirectly homogeneously heated through the conductor film having stable absorptivity regardless of the surface state of the amorphous film, whereby the yield is improved in crystallization of the amorphous film.

Method of fabricating semiconductor device

A method of fabricating a semiconductor device capable of fabricating a semiconductor device including a polycrystalline semiconductor film having excellent characteristics with a high yield is provided. A first amorphous semiconductor film is formed on a substrate. A conductive film is formed on the first amorphous semiconductor film. The conductive film is irradiated with an electromagnetic wave such as a high-frequency wave or a YAG laser beam thereby making the conductive film generate heat and converting the first amorphous semiconductor film to a first polycrystalline semiconductor film through the heat. Thus, polycrystallization is homogeneously performed without dispersion through the heat from the conductive film irradiated with the electromagnetic wave. Consequently, an excellent first polycrystalline silicon film can be formed with an excellent yield.

Method of fabricating a thin film transistor using electromagnetic wave heating of an amorphous semiconductor film

A method is obtained of manufacturing a semiconductor device including a semiconductor layer with high field-effect mobility. According to the semiconductor device manufacturing method, a semiconductor layer is formed on a substrate and then the semiconductor layer is irradiated with high energy beam. Then, a heat treatment is provided under a temperature condition capable of reducing the surface roughness of the semiconductor layer. The radiation of high energy beam toward the semiconductor layer improves the crystalinity of the semiconductor layer and the subsequent heat treatment reduces the surface roughness of the semiconductor layer to enhance the field-effect mobility of the semiconductor layer.

Growing community of inventors

Gifu, Japan

Naoya Sotani