Kyocera Corporation

Naoya Kobamoto

Tomonari Sakamoto

Yuta Shinike

Norikazu Nakatani

Ken'ichi Okada

Kenji Fukui

Takafumi Miyake

Hiroshi Ueda

Masayasu Yoshioka

Ken-ichi Okada

Ken-Ichi Okada

A solar cell element according to an embodiment of the present invention includes a semiconductor substrate that includes a first semiconductor layer of one conductivity type and a second semiconductor layer of the opposite conductivity type, and a plurality of linear current collector electrodes that are arranged on a first main surface of the semiconductor substrate at the second semiconductor layer side, the plurality of linear current collector electrodes being arranged at intervals in a direction from a middle part toward both end parts of the first main surface. A distance between neighboring ones of the current collector electrodes located in the middle part and a distance between neighboring ones of the current collector electrodes located in the both end parts are different from each other.

Solar cell element, segmented solar cell element, solar cell module, and electronic appliance

A solar cell element comprising a semiconductor substrate including a first surface to receive light, and a second surface provided on a back side of the first surface, a plurality of base collector electrodes provided on the second surface of the semiconductor substrate, a plurality of collector electrodes provided on the plurality of base collector electrodes, a connector electrode to electrically connect the collector electrodes adjacent to each other across a region between the plurality of base collector electrodes among the plurality of collector electrodes. A first extracting electrode provided between the plurality of base collector electrodes, and a second extracting electrode electrically connected to at least one of the plurality of collector electrodes.

Solar cell element and solar cell module

A solar cell with a simple configuration and high efficiency, and a manufacturing method therefor are provided. A solar cell of the present invention includes a semiconductor substrate that has a first surface receiving sunlight and a second surface on the back side of the first surface and that includes a through hole passing through between the first surface and the second surface; and a first electrode that includes a main electrode portion containing a glass component and formed on the first surface of the semiconductor substrate and a conducting portion electrically connected to the main electrode portion, formed in the through hole of the semiconductor substrate, and having a lower glass-component content than the main electrode portion.

Solar cell and solar cell manufacturing method

A solar cell module with a simple configuration and high efficiency is provided. A solar cell module of the present invention is configured by electrically connecting a plurality of solar cell elements. Each of the plurality of solar cell elements includes a plurality of first connection parts representing wiring connection parts in a first electrode and a plurality of second connection parts representing wiring connection parts in a second electrode on the same surface. A first solar cell element and a second solar cell element arranged adjacent to each other have portions of the plurality of first connection parts of the first solar cell element and the plurality of second connection parts of the second solar cell element connected by a wiring having a linear form in plan view.

Solar cell module

A solar cell module comprises a plurality of solar cell elements including a front surface electrode and a wiring member electrically interconnecting the solar cell elements. The front surface electrode includes a bus bar electrode and finger electrodes, the finger electrodes including a plurality of first finger electrodes and connected to the bus bar electrode, and a plurality of second finger electrodes not connected to the bus bar electrode. The front surface electrode further includes a fine wire electrode that is disposed in a region extending from the bus bar electrode in a longitudinal direction of the bus bar electrode and that is electrically connected to the second finger electrodes, the fine wire electrode including first and second fine wire electrodes intersecting to each other. The wiring member is connected to an intersection of the first and second fine wire electrodes and to the bus bar electrode.

A semiconductor substrate comprises a semiconductor region of one conductivity type and a layer of another conductivity type with first, second and side surfaces. Over surfaces on the first surface side, the side surface side and an outer peripheral portion on the second surface side of the semiconductor region, the layer is formed. An electrode of the one conductivity type is located on the second surface adjacent to the layer. The semiconductor substrate includes a trench located between the outer periphery of the second surface and an end of the electrode with a spacing from the electrode and configured to isolate the layer along the outer periphery of the second surface. When viewed from the second surface side, a shortest distance between the end of the electrode and the trench is smaller than a shortest distance between a junction of the layer of the side surface side and the trench.

Growing community of inventors

Higashiomi, Japan

Naoya Kobamoto