Hitachi, Ltd.

Renesas Technology Corp.

Elpida Memory, Inc.

Hitachi Medical Corporation

Naoya Kanda

Hiroyuki Tenmei

Hiroshi Hozoji

Yoshihide Yamaguchi

Shigeharu Tsunoda

Kosuke Inoue

Noriyuki Oroku

Madoka Minagawa

Asao Nishimura

Ichiro Anjo

Kunio Matsumoto

Kenji Ujiie

Akira Yajima

Tsuyoshi Fujita

Gyozo Toda

Hiroaki Okudaira

Takashi Kuroki

Shousaku Ishihara

Hitoshi Yokono

Hiroshi Honma

Takao Terabayashi

Osamu Miyazawa

Akira Tomizawa

Takanobu Noro

Jiro Ushio

Toyoki Asada

Yasushi Ishikawa

Setsuo Ando

Naoko Matsuura

Takashi Kobayashi

Hiroaki Ikeda

Kunihiko Nishi

Minoru Yoshida

Yasuhiro Naka

Masachika Masuda

Kenchi Ito

Masahide Harada

Junichi Saeki

Isamu Yoshida

Yasuo Hira

Tatsuya Nagata

Masataka Shiba

Sueo Kawai

Masahiro Yamaguchi

Hidehiko Kando

Ryohei Satoh

Kazumi Kawamoto

Kouichi Uesaka

Takanori Aono

Masakazu Ishino

Ritsuro Orihashi

Kazuhiko Horikoshi

Yuji Fujita

Hidemi Sato

Akira Inagaki

Akira Murata

Akira Yabushita

Katsunori Asafusa

Michifumi Kawai

Tetsuya Yamazaki

Suguru Sakaguchi

Yasuo Amano

Hideo Yamakura

Akio Fujiwara

Hiroshi Asao

Ikuo Kawaguchi

Ichiro Miyano

Atsuko Fukushima

Muneo Oshima

Akihiro Ando

Masanori Shibamoto

Takayoshi Sowa

Tooru Yoshida

Mari Matsuyoshi

Hiroshi Homma

Shigeharu Tunoda

Kie Ueda

Yoshio Oozeki

Yasuhiro Narikawa

A circuit chip having a loop-shaped antenna coil on a main surface and a tag sheet having an antenna pattern on a main surface are prepared, and the circuit chip is mounted on the main surface of the tag sheet so as not to place over the antenna pattern. The circuit chip is placed closely to the antenna pattern, and at least the half of the main surface is desirably faced against the antenna pattern. Thus, signals and/or power can be securely exchanged between the circuit chip (or antenna coil) and the antenna pattern. Therefore, a high-performance and rigid RFID tag can be obtained by roughly aligning the circuit chip and the tag sheet.

RFID tag

For protecting information stored in an RFID chip and ensuring its authenticity, radio communication between the RFID chip and an external terminal is positively interrupted when a seal type RFID tag including the RFID chip is peeled from an adherend, while ensuring solidity integrity when the RFID tag is put on the adherend. In the seal type RFID tag which includes the RFID chip fixed on a mounting surface of a base member having an adhesive layer applied thereto and which is put on the adherend by using the adhesive layer, an antenna formed on a main surface of the RFID chip is embedded in adhesive layers together with the RFID chip and an adhesive bonding strength between the antenna and the adhesive layer is made greater than a joining strength between the antenna and the RFID chip.

There is provided an ultrasound probe including a first substrate having a silicon substrate and an ultrasound transmit-receive element, an acoustic lens disposed over an upper surface of the first substrate, and a damping layer disposed under the first substrate, in which a second substrate is disposed between a lower surface of the first substrate and an upper surface of the damping layer, and the second substrate is made of a material having approximately the same linear expansion coefficient and acoustic impedance as the silicon substrate of the first substrate. With this structure, it is possible to provide the ultrasound probe which can prevent damage to the silicon substrate due to temperature change and has excellent transmission/reception performance and structure reliability while reducing noise by reflected waves in transmission and reception.

Ultrasound probe

A method for manufacturing a semiconductor device includes the steps of forming first and second semiconductor wafers each including an array of chips and elongate electrodes, forming a groove on scribe lines separating the chips from one another; coating a surface of one of the semiconductor wafers with adhesive; bonding together the semiconductor wafers while allowing the groove to receive therein excessive adhesive; and heating the wafers to connect the elongate electrodes of both the semiconductor wafers.

Method for manufacturing a three-dimensional semiconductor device and a wafer used therein

Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a positioning pin into the positioning holes respectively, so that one side of the substrate faces one side of the cut pieces. Subsequently, internal terminals provided on the substrate are ultrasonically joined with internal terminals provided on the cut pieces by pressing an ultrasonic tool from the other side of the cut pieces. As a result, connection between these can be performed highly accurately. Further, since the internal terminals are ultrasonically joined with each other, operation time does not increase in proportion to the number of terminals, as in the connection using a bonding wire, and misregistration due to heat does not occur. Accordingly, connections between circuit boards are performed efficiently, highly accurately, and reliably.

Semiconductor device, manufacturing method thereof, and connection method of circuit board

A RFID tag including: a paper-like structure inlaying a RFID thread between a first paper layer and a second paper layer, the RFID thread being connected to a RFID chip through bumps to an antenna arranged onto a base member and being formed with a protecting material provided with a window at a position in which the RFID chip corresponds; wherein a height of an upper surface of the protecting material is larger than a height of an upper surface of the RFID chip.

Paper tag identified by using radiofrequency and method of manufacturing the same

When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the semiconductor chip is suppressed to avoid the damage of the semiconductor chip. For this purpose, the present invention provides an RFID-tagwherein gold bumps are joined to the metal foil by pressing the gold bumps formed on the semiconductor chip against an antenna member, and impressing ultrasonic waves; and the RFID-tag wherein a matte surface having a low glossiness is formed on the metal foil, or a surface having shallow rolling streaks is formed on the metal foil, and gold bumps are joined to the surface.

RFID-chip having RFID-tag or magnifying electrode

A paper-like RFID tag is fabricated by bonding bumps of an RFID chip to an antenna to connect the chip to the antenna, the antenna being formed by a metal foil bonded onto a base film or a base tape, providing a protecting material around the RFID chip so that an upper surface becomes higher than that of the RFID chip, to constitute an RFID thread, and inlaying the RFID thread in between first and second paper layers to afford a paper-like structure. The thickness of the paper-like RFID tag fabricated as above is 0.1 mm or less. Further, the paper-like RFID tag is of high quality and has a surface smoothness almost equal to that of the ordinary type of paper, permitting a long-distance communication.

A highly reliable inexpensive RFID medium (Radio-frequency Identification medium) and a method of manufacturing the same is provided, particularly for small, thin RFID mediums. A RFID medium includes a transmitting/receiving antennaand an IC chipA rectangular part of a base sheethaving a major surface on which transmitting/receiving antennasare formed, is folded along one of the long sides thereof, and the other three sides are bonded to the base sheetso as to cover the transmitting/receiving antennaand the IC chipconnected to the transmitting/receiving antennaThe base sheethas spacing parts of a predetermined shape for covering the transmitting/receiving antennaand the IC chipconnected to the transmitting/receiving antennaThe transmitting/receiving antennasand the spacing partsare arranged alternately. The base sheetis rolled in a roll.

Wireless communication medium and method of manufacturing the same

There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

Method of manufacturing RFID

A semiconductor device which includes a semiconductor chip, an insulating film formed on the semiconductor chip, a plurality of projected stress relaxation materials formed on the insulating film, projected electrodes covering at least tops of the stress relaxation materials, and wiring lines for electrically connecting the projected electrodes and element electrodes of the semiconductor chip.

Semiconductor device having projected electrodes and structure for mounting the same

A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide &#x3b1;-ray shielding of the semiconductor device.

Semiconductor device and method for producing the same

A semiconductor module, comprising a wiring substrate on which wiring is formed, a semiconductor device electrically connected to the wiring formed on the wiring substrate, and an external connection terminal arranged on the semiconductor device mounted side of the wiring substrate so as to be a connected portion between the wiring and the outside electrically connected thereto, wherein there is formed an insulating resin layer thicker than the semiconductor device between the wiring substrate and the external connection terminal.

Semiconductor module

A semiconductor device is provided which enables a flip chip connection without use of underfill. The semiconductor device includes a semiconductor element having circuit electrodes and a circuit surface coated with a protecting film. A stress relaxation layer is provided by coating a cured thermoplastic resin onto the protecting film of the circuit surface in a manner which leaves the circuit electrodes exposed and curing it and having an inclination in the edge portion thereof. A wiring layer with wirings is connected to each of the circuit electrodes and disposed so as to make an electrical connection from the circuit electrodes, via the edge portion of the stress relaxation layer, and to a desired portion on the surface of the stress relaxation layer. A protecting film is provided thereon, and an external connection terminal is also provided.

Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure

A semiconductor apparatus comprising a semiconductor device, an electrically insulating layer formed on the semiconductor device, and an external connection terminal formed on the electrically insulating layer and electrically connected to an electrode of the semiconductor device, wherein a power/ground line and a signal line in a region of from an edge of the electrically insulating layer to a uniform-thickness flat portion of the electrically insulating layer are different in kind of wiring pattern from each other.

Semiconductor apparatus including insulating layer having a protrusive portion

Growing community of inventors

Fujisawa, Japan

Naoya Kanda