Dic Corporation

Naoto Yagi

Junji Yamaguchi

Yasuhiro Takada

Makoto Yada

Takayuki Miki

Takeshi Ibe

Shinichi Kudo

Hideki Torii

Hisashi Tanimoto

Noriyuki Iwadate

Kenichiro Oka

A polyarylene ether ketone resin includes repeating units represented by general formulae (1-1), (2-1), and (3-1) below. (In the formula (1-1), m1 is an integer of any one of 1 to 3). (In the formula (2-1), m2 is an integer of any one of 1 to 3). (In the formula (3-1), n is an integer of any one of 0 to 2).

Polyarylene ether ketone resin, production method thereof, and molded product

There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25&#xb0; C. and in a state of not containing a solvent is in the range of 3 mPa&#xb7;s to 8,000 mPa&#xb7;s.

Curable composition for imprinting

A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

Curable composition, resist material and resist film

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Sakura, Japan

Naoto Yagi