Tdk Corporation

Naoto Tsukamoto

Makoto Iwasaki

Masashi Gotoh

Yoshihiko Minachi

Minao Himeno

Takahiro Mori

Kenji Horino

Hitoshi Saita

Chikara Ishizaka

Hidetake Itoh

Tetsuya Hidaka

Hiroaki Hasegawa

Yoshihiko Ohashi

Takuma Hayakawa

Fumitaka Baba

Kiyoshi Uchida

Akira Shibue

Shinichi Sakano

Ayato Kakoki

Tomohiko Aida

Takahiro Kawashima

Mitsuaki Sugiyama

Hiroshi Miyasaka

An R-T-B based sintered magnet includes 'R', 'T', and &#x201c;B&#x201d;. &#x201c;R&#x201d; represents a rare earth element including at least Tb. &#x201c;T&#x201d; represents a metal element except rare earth elements including at least Fe, Cu, Mn, Al, and Co. &#x201c;B&#x201d; represents boron or boron and carbon. With respect to 100 mass % of a total mass of the R-T-B based sintered magnet, a content of &#x201c;R&#x201d; is 28.0 to 32.0 mass %, a content of Cu is 0.04 to 0.50 mass %, a content of Mn is 0.02 to 0.10 mass %, a content of Al is 0.15 to 0.30 mass %, a content of Co is 0.50 to 3.0 mass %, and a content of &#x201c;B&#x201d; is 0.85 to 1.0 mass %. Tb2/Tb1 is 0.40 to less than 1.0, where Tb1 and Tb2 (mass %) denote a content of Tb at a surface portion and at a core portion, respectively.

R-T-B based sintered magnet

An R-T-B based sintered magnet includes a first main surface and a first side surface. The first main surface has a coercivity that is higher than that of the first side surface. &#x394;Hcj&#x2264;60 kA/m is satisfied, where &#x394;Hcjis a difference in coercivity between a portion having a highest coercivity on the first main surface and a portion having a lowest coercivity on the first main surface. &#x394;Hcj&#x2264;60 kA/m is satisfied, where &#x394;Hcjis a difference in coercivity between a portion having a highest coercivity on a first cross section and a portion having a lowest coercivity on the first cross section and the first cross section is a cross section parallel to the first main surface and spaced from the first main surface at a predetermined length or more.

R-T-B based sintered magnet and motor

An injection molding composition includes a ferrite powder which is a collection of ferrite particles, a first binder and a second binder, wherein a softening point of the second binder is lower than that of the first binder, a weight and a specific surface area of the ferrite powders are represented by Wp and S, and a weight and a density of the first binder and the second binder is represented by Wb1, Wb2, and Db1, Db2, and a hypothetical thickness Tb1 of the first binder is 0.6 to 3.0, and a hypothetical thickness Tb2 of the second binder is 5.0 to 16.0. In the composition, it is preferable that coated ferrite particles covering the outer circumference of the ferrite particles with the first binder and the second binder exist.1 [nm]=(1&#xd7;10)/(1&#xd7;)&#x2003;&#x2003;formula (1)2 [nm]=(2&#xd7;10)/(2&#xd7;)&#x2003;&#x2003;formula (2).

Injection molding composition and producing method thereof

An injection molding composition, having a small fluctuation characteristic and a better characteristic, is provided. The above composition is the injection molding composition comprising a ferrite powder which is a collection of ferrite particles, a first binder and a second binder. A weight and a specific surface area of the ferrite powders are represented by Wp and S, and a weight and a density of the first binder and the second binder is represented by Wb, Wb, and Db, Db. A hypothetical thickness Tbof the first binder is 2.0 to 15.0, and a hypothetical thickness Tbof the second binder is 16.5 to 32.0. In the composition, it is preferable that coated ferrite particles coating the outer circumference of the ferrite particles with the first binder and the second binder exist.1 [nm]=(1&#xd7;10)/(1&#xd7;)&#x2003;&#x2003;formula (1)2 [nm]=(2&#xd7;10)/(2&#xd7;)&#x2003;&#x2003;formula (2)

An electrochemical device according to the present invention has an outer package including a metal film; a battery element enclosed in the outer package; resin layers provided at least inside a sealing region of the outer package; and a lead extending from the battery element through between the resin layers in the sealing region of the outer package to the outside of the outer package, and a shape of the lead in the sealing region includes front and back surfaces both consisting of curved surfaces. In the sealing region, a maximum thickness Zof the lead near a lateral center position of the lead and a thickness Zat a lateral end position of the lead satisfy the relation of Z&#x3c;Z. This electrochemical device comes to have high quality.

Electrochemical device and manufacturing method thereof

An electro-chemical device comprises a package including a metal film, a battery element sealed within the package, resin layers disposed at least on the inside of a seal part of the package, and a lead extending from the battery element to the outside of the package through between the resin layers at the seal part of the package. The lead has a special form into which the resin of the resin layers bites, so that the lead is firmly buried in the resin layers, whereby the lead is fully inhibited from moving. Therefore, an electro-chemical device having a high quality can be obtained.

Electro-chemical device and method for manufacturing the same

A thin-film capacitor has a high insulation resistance value with high reliability. The thin-film capacitor includes a dielectric thin film and electrodes opposing each other through the dielectric thin film, the dielectric thin film containing a perovskite-type composite oxide having a composition expressed by (1), Mn, and at least one kind of element M selected from V, Nb, and Ta; wherein the dielectric thin film has an Mn content of 0.05 to 0.45 mol with respect to 100 mol of the composite oxide; and wherein the dielectric thin film has a total element M content of 0.05 to 0.5 mol with respect to 100 mol of the composite oxide:ABO&#x2003;&#x2003;(1)where A is at least one kind of element selected from Ba, Sr, Ca, and Pb, B is at least one kind of element selected from Ti, Zr, Hf, and Sn, and 0.97&#x2266;y&#x2266;0.995.

Thin-film capacitor and electronic circuit board

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Tokyo, Japan

Naoto Tsukamoto