Disco Corporation

Naoto Takata

Masaaki Nagashima

Takashi Mori

Shinichi Namioka

Masaaki Suzuki

Noriko Ito

Hirotoshi Hoshikawa

Osamu Miura

Hidetaka Ochi

A method of grinding a surface of a workpiece that has surface irregularities includes a first grinding step of grinding the surface of the workpiece by a predetermined amount of stock removal while keeping a measuring element of a height gauge out of contact with the surface of the workpiece, thereafter, a height difference measuring step of bringing the measuring element of the height gauge into contact with the surface of the workpiece and measuring a height difference of surface irregularities on the surface of the workpiece with the height gauge, and a second grinding step of, if the measured height difference is larger than a preset range, grinding the surface of the workpiece while keeping the measuring element of the height gauge in contact with the surface of the workpiece until the measured height difference falls within the preset range.

Method of grinding workpiece

A grinding apparatus for grinding a wafer stored in a cassette composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting waste water generated in grinding the wafer by operating the grinding unit.

Grinding apparatus

Growing community of inventors

Tokyo, Japan

Naoto Takata