Origin Company, Limited

Origin Electric Company, Limited

Koki Company Limited

Naoto Ozawa

Hideo Kobayashi

Takayuki Suzuki

Tatsuo Okubo

Jun Matsuda

Arisa Shiraishi

Mitsuyasu Furusawa

Yukiko Hayashi

Masahiro Nakamura

Takeshi Shirai

Shinichi Shinohara

Noriyoshi Uchida

Miya Yamazaki

Masanobu Nagahama

The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.

Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package

A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.

Method for manufacturing bonded object and bonded object manufacturing apparatus

A method for manufacturing a target object coated with a coating substance, whose edge face portions and flat face portion can be covered with the coating substance with a predetermined thickness, is provided. The target object T includes a flat face portion Tf and an edge face portion Te continuous from the portion Tf which includes a coating flat surface Tsp formed thereon which has a flat face. The portion Te includes a coating edge surface Tsc which includes at least one of a curved surface or a flat surface that is not parallel to the surface Tsp. The method includes a coating substance supply step of supplying the substance R along at least the surface Tsp, and an edge face portion coating substance adjustment step of adjusting the substance R supplied to the surface Tsc or moved from the surface Tsp to cover the surface Tsc at a predetermined thickness.

Method for manufacturing target object coated with coating substance

A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axislocated remotely from the object T. A coating substance spreading apparatusincludes a revolution sectionconfigured to revolve an object T about a revolution axislocated remotely from the object T. With these, a coating-substance-moving force that acts on each portion of the coating target surface Tf can be made close to an intensity proportional to a distance from the revolution axis, and it is possible to suppress thickness differences or variation of the coating substance coated on the coating target surface Tf.

Method for manufacturing coated object and coating substance spreading apparatus

The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig. The method for producing a soldered product of the present invention comprises:

Method for producing soldered product

To provide a work processing apparatus equipped with a vaporizer that requires no carrier gas and can vaporize a vaporization target liquid having a relatively high flow rate, and a method for manufacturing a processed work. A vaporizerincludes a vaporization partincluding a heat storage bodyhaving a heat capacity higher than that of a vaporization target liquid Fq by a predetermined ratio, and a heat supplierfor supplying heat to the vaporization part. The predetermined ratio is a ratio of heat capacity at which a temperature drop of the heat storage bodyby heat transfer from the heat storage bodyto the liquid Fq flowing through a pathis within a predetermined range, wherein the amount of heat transferred from the heat storage bodyto the liquid Fq is an amount of heat necessary to vaporize the liquid Fq at a planned proportion. A work processing apparatusincludes the vaporizer, a chamber, and a vacuum pumpfor creating a negative pressure in the chamber. The method of manufacturing a processed work includes taking the work W into the chamber, supplying a processing gas Fg generated in the vaporizerinto the chamber, and performing predetermined processing on the work W under an atmosphere of the processing gas Fg in the chamber

Work processing apparatus and method for manufacturing a processed work

The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Solder paste for reduction gas, and method for producing soldered product

To provide a method for estimating a concentration of carboxylic acid gas, which is capable of measuring safely the concentration of carboxylic acid gas such as formic acid gas or the like in a chamber of a soldering apparatus in real time, and a soldering apparatus capable of estimating the concentration of the carboxylic acid gas in the chamber. The method includes the steps of measuring a surface temperature of a same object placed in the chamber at a same point in time by using a thermometer (first thermometer) for measuring a temperature without any influence of infrared absorption by carboxylic acid, and a radiation thermometer (second thermometer) for measuring a temperature by infrared in a wavelength region that the carboxylic acid absorbs, and estimating the concentration of the carboxylic acid gas in the chamber on the basis of a temperature difference (&#x394;Tx) between temperatures indicated by the first and second thermometers. The soldering apparatus includes a heating stage (), a gas introducing part () for introducing a mixed gas of an inert gas and a carboxylic acid gas, a gas discharging part (), first thermometer () and second thermometer ().

Method for estimating carboxylic acid gas concentration and soldering apparatus

A method for forming a resin film is provided in which a liquid material is cured by shifting irradiation of light from a central side to an outer circumferential side of a substrate during or after spreading a liquid material on the substrate by rotation, in which the light is annular, and an inner diameter and an outer diameter of the annular light are increased concentrically in relation to a central axis of rotation as irradiation time progresses, so that the annular light shifts from the central side to the outer circumferential side of the substrate.

Method and apparatus for forming resin film

In order to control a warp of a disc substrate so as to be a desired level, an optical disc production method includes: a step of supplying resin on the disc substrate; a step of mounting the disc substrate on an inside diameter portion of a turntable after supplying the resin; a step of providing an air-gap between an outside diameter portion of the turntable and a portion of the disc substrate that is not mounted; a step of extending the resin by spinning; and a curing step of curing the resin while spinning the disc substrate mounted on the inside diameter portion of the turntable, wherein in the step of extending the resin, a negative pressure is affected on a portion of the disc substrate that is not mounted, and in the curing step, the warp is controlled by curing the resin on the spinning disc substrate while maintaining effect of the negative pressure.

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Saitama, Japan

Naoto Ozawa