Senju Metal Industry Co., Ltd.

Naoto Kameda

Kaichi Tsuruta

Kota Kikuchi

Takashi Hagiwara

Hiroyuki Yamasaki

Manabu Muraoka

Masato Tsuchiya

Takeo Saitoh

Takashi Obayashi

Shigeyuki Sekine

Hideki Nakamura

Koji Watanabe

Isamu Sato

Osamu Munekata

Kanta Dei

Michio Suzuki

Katsuji Nakamura

A layered bonding materialincludes a base material, a first solder sectionstacked on a first surface of the base material, and a second solder sectionstacked on a second surface of the base material. A coefficient of linear expansion of the base materialis 5.5 to 15.5 ppm/K, the first solder sectionand the second solder sectionare made of lead-free solder, and both of a thickness of the first solder sectionand a thickness of the second solder sectionare 0.05 to 1.0 mm.

Layered bonding material, semiconductor package, and power module

In a layered bonding material, a coefficient of linear expansion of a base materialis 5.5 to 15.5 ppm/K and a first surface and a second surface of the base materialare coated with pieces of lead-free solderand

A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Flux applying device

In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solderand the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

Liquid coating device

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few &#x3bc;m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG., this apparatus comprises a solder bathof accommodating the molten solder; a second conveying sectionfor drawing up a strip memberfrom the solder bath; and a blower sectionfor blowing hot gas on the strip memberimmediately after being drawn up from the solder bath by a second conveying section; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder. According to this configuration, the excess molten soldercan be trimmed from the strip membercorresponding to composition of the molten solder. Thus, the film thickness of the molten soldercoated on the strip membercan be controlled evenly and in increments of a few &#x3bc;m.

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

Growing community of inventors

Tochigi, Japan

Naoto Kameda