Ibiden Company Limited

Other

Naoto Ishida

Kiyotaka Tsukada

Kouji Asano

Atsushi Shouda

Naohiro Hirose

Kouta Noda

Hiroshi Segawa

Honjin En

Takema Adachi

Mitsuhiro Kondo

Hisashi Minoura

Kota Noda

Nobuhisa Kuroda

Kenji Chihara

Morio Nakao

Naoki Katsuda

Koji Asano

Teruo Hayashi

A method for manufacturing a printed wiring board includes forming on a support sheet an intermediate body including a first insulation layer, a second insulation layer and a first conductive layer interposed between the first insulation layer and the second insulation layer, and separating the support sheet from the intermediate body including the insulation layer, the first conductive layer and the second insulation layer such that the intermediate body is detached from the support sheet.

Method for manufacturing printed wiring board

A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second laminated structure on second surface of the substrate and including a conductive circuit layer on the second surface of the substrate, a resin insulating layer and the outermost conductive circuit layer. The outermost conductive layer in the first structure has solder pads positioned to mount a semiconductor element and solder bumps formed on the pads, respectively, the outermost conductive layer in the second structure has solder pads positioned to mount a wiring board, and the outermost conductive layers in the first and second structures have thicknesses formed greater than thicknesses of the conductive layers on the surfaces of the substrate.

Multilayer printed wiring board for mounting semiconductor element

A printed wiring board includes a core substrate including an insulative substrate, a first conductive layer formed on first surface of the insulative substrate, and a second conductive layer formed on second surface of the insulative substrate, a first buildup laminated on first surface of the core and including an interlayer insulation layer, a conductive layer formed on the insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer, and a second buildup laminated on second surface of the core and including an interlayer insulation layer, a conductive layer formed on the interlayer insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer. The insulation layer of the first buildup has thermal expansion coefficient set higher than thermal expansion coefficient of the insulation layer of the second buildup.

Printed wiring board

A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup layer laminated on first surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on second surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost interlayer resin insulation layer of the first buildup layer has thermal expansion coefficient which is set lower than thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer.

A printed wiring board includes a core substrate, a first buildup layer laminated on a first surface of the core substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on a second surface of the core substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost conductive layer of the first buildup layer includes pads positioned to mount a semiconductor device on a surface of the first buildup layer, and the outermost interlayer resin insulation layer of the first buildup layer has a thermal expansion coefficient which is set lower than a thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer.

An opening is formed in resinby a laser beam so that a via hole is formed. At this time, copper foil, the thickness of which is reduced (to 3 &#x3bc;m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an openingcan be formed in the resinif the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resinwhich forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Multilayered printed circuit board and manufacturing method thereof

Method of manufacturing a multilayered printed circuit board

Method of manufacturing multilayered circuit board

A printed wiring board has a circuit substratehaving a conductor circuitand a through holeand also has a joining pininserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party padThe joining pin is constructed by a joining head portionhaving a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portionhaving a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering materialetc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Printed wiring board and manufacturing method therefor

A printed circuit board providing superior adhesion between a substrate and a conductor pattern and preventing damage of the substrate . The width c of the bottom surface of the conductor pattern is greater than the width d of the top surface . Accordingly, the conductor pattern has a trapezoidal cross-section. The two side surfaces of a lower portion of the conductor pattern are coated by a solder resist. The two side surfaces at the upper portion of the conductor pattern are exposed from the solder resist . A solder ball engages the two side surfaces

Printed-circuit board and method of manufacture thereof

A printed wiring board has a circuit substrate having a conductor circuit and a through hole , and also has a joining pin inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad . The joining pin is constructed by a joining head portion having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material , etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

An opening is formed in resin by a laser beam so that a via hole is formed. Copper foil, the thickness of which is reduced to 3 &mgr;m by etching to lower the thermal conductivity, is used as a conformal mask. Therefore, an opening is formed in the resin and the number of irradiation of pulse-shape laser beam is reduced. Thus, occurence of undercut of the resin, which forms an interlayer insulating resin layer, can be prevented and the reliability of the connection of the via holes can be improved.

Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating

A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate ( ) including ad core pattern ( ), which has a pad ( ), is first prepared. Then, a laminated plate is formed by laminating an insulating layer ( ) on the surface of the core substrate. Afterward, a surface pattern ( ) is formed on the surface of the laminated plate. Further, the conductive hole ( ) is formed by irradiating a laser beam at the laminated plate. The bottom opening of the conductive hole ( ) is covered by the pad ( ).

Multilayer printed wiring board and method for manufacturing the same

A printed wiring board has a circuit substrate having a conductor circuit and a through hole and also has a joining pin inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad . The joining pin is constructed by a joining head portion having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Printed wiring board with joining pin and manufacturing method therefor

An electronic component mounting base board has an insulating substrate provided with a conductor circuit and a mount portion for an electronic component, and a heat slug adhered to the insulating substrate, wherein the heat slug is comprised of a flat main body and a projection portion extending vertically from a side face of the main body, and provided with a slit deforming portion absorbing deformation of the insulating substrate.

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Ogaki, Japan

Naoto Ishida