Omron Corporation

Naoto Inoue

Tsuyoshi Miyata

Kazunari Komai

Satoshi Hirono

Manabu Ikoma

Kiyohiko Gondo

Akio Sumiya

Shintaro Hara

Ryo Sugihara

Shingo Yamamoto

Yasuo Matsuda

Makoto Tami

Fumiaki Tanaka

Shota Akinaga

An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10seconds to 10seconds.

Optical fiber and manufacturing method thereof

An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.

Optical semiconductor package, optical semiconductor module, and manufacturing method of these

A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.

Power module

Growing community of inventors

Shiga, Japan

Naoto Inoue