Panasonic Corporation

Panasonic Electric Works Co., Ltd.

Panasonic Electric Works, Ltd.

Sumitomo Chemical Company, Limited

Naoto Ikegawa

Satoshi Okamoto

Youichiro Nakahara

Hiroshi Inoue

Yoshiyuki Uchinono

Junji Imai

Shiro Katagiri

Mitsuru Kobayashi

Yasufumi Masaki

Hitoshi Makinaga

Kyohei Uemura

A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

Circuit board and method of manufacturing the same

The inventors have conducted vigorous studies, and discovered as a result that it is possible to form a silver layer having a high reflectance of about 90 to 99% in a visible light area by setting a grain size of an outermost surface of a silver plated layer within a range of 0.5 &#x3bc;m or more to 30 &#x3bc;m or less.

Silver layer formed by electrosilvering substrate material

In a pressure sensor including a pressure detecting element in an intermediate portion or at a deep side of a through hole formed in a protrusion, a body portion (a base portion and the protrusion) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern is formed on a surface thereof. Accordingly, a smaller pressure sensor can be obtained.

Pressure sensor

Growing community of inventors

Tsu, Japan

Naoto Ikegawa