Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Toyota Jidosha Kabushiki Kaisha

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Holdings Corporation

Naoto Hosotani

Shozo Minamitani

Kenichi Nishino

Koichi Morita

Kenji Takahashi

Kazuki Fukada

Syunji Onobori

Satoshi Shida

Takashi Shimizu

Shinji Kanayama

Kazushi Higashi

Hidenobu Nishikawa

Hiroshi Yamauchi

Yasuhiro Asaida

Hiroshi Nasu

Katsuhiko Watanabe

Akihiro Yamamoto

Yukio Nishikawa

Takuya Nakashima

Hiroshi Takasaki

Wataru Hirai

Daido Komyoji

Daisuke Kishii

Youichi Nakamura

Yoshikazu Yoshimura

Kunio Sakurai

Tsuneyuki Ejima

Shunji Onobori

Takahiro Kuhara

Hideaki Hamada

Sakae Kobayashi

Shuji Ono

Ryuta Abe

Yukihiro Maegawa

Naomi Kaino

Keiichi Iwata

Mitsuo Maeno

A laminating device includes: a plurality of laminating heads that each holds a unit laminated body; a drum section in which the plurality of laminating heads are arranged, which holds each laminating head swingably via a support shaft, and which rotates to advance each laminating head to a laminating position facing a lamination stage; a cam section which is in contact with each laminating head and which causes each laminating head to swing around the support shaft in association with a movement of each laminating head caused by a rotation of the drum section; and a biasing member that biases each laminating head in a radial direction of the drum section.

Laminating device

The present invention provides a battery block that accommodates unit cells having higher capacities, and, even in case of abnormal heat generation in the unit cell, does not cause abnormal heat generation in the neighboring unit cells, thereby preventing a chain reaction of degradations and abnormalities of the accommodated unit cells. The battery block of the present invention includes a battery case having a minimum thickness section satisfying the relationship 'K2/K1&#x2267;K3&#x2212;1'. K1 is the thermal conductance between the battery case and the unit cell. K2 is the thermal conductance of the minimum thickness section of the battery case between two neighboring holes for accommodating the respective unit cells. K3 is a ratio between the abnormal heat temperature of a reference cell and the ambient temperature causing abnormal heat generation in this cell.

Battery block

A battery module in which the temperature of a cell with an increased high temperature due to an abnormal state can be quickly reduced so that the high temperature does not affect adjacent cells is provided. A battery modulehas a configuration in which a plurality of cellsas secondary batteries are housed in a casehaving a plurality of housing parts housing, but not in contact with, the cells, and when a gas is generated in one of the cellsto cause the cellto expand, this cellcomes into contact with the associated one of the housing parts.

Battery module

A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Component connecting apparatus

A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.

Pressurizing method

Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus

There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel. Thus, the electronic components can be mounted onto the circuit board in a short process time.

Component mounting apparatus

There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.

Bonding head and component mounting apparatus

A heating and pressurizing apparatus ( ), to which a circuit board ( ) with electronic components ( ) pre-bonded thereto via bonding elements ( ) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member ( ) having a heating device ( ). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.

Method and apparatus for mounting component

A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body.

A component mounting apparatus includes a component holding and conveying device for holding and conveying a component and mounting the component onto a circuit board, a circuit board holding device for holding the circuit board, an image recognition optical system for performing recognition of the component and the circuit board with different fields of view, respectively, and a control section. The control section repeatedly determines an optical axis shift amount with the two fields of view between a position of the component and a position of the circuit board recognized by the image recognition optical system. Based on these determination results, the control section determines an optical axis shift amount for calibration, wherein calibration of the image recognition optical system is performed based on the optical-axis shift amount for calibration determined by the control section. Then, the component is mounted onto the circuit board.

Component mounting apparatus and method

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Osaka, Japan

Naoto Hosotani