Fujifilm Business Innovation Corp.

Naoto Chiba

Misaki Suruga

Seiya Imai

Yusuke Kabe

Takaaki Yoshida

Koichi Tabira

A pallet includes: a top plate that has a rectangular shape and that is to be loaded with a load object; multiple blocks that are disposed at a multiple locations including four corners of the top plate and that support the top plate from below; and a bottom plate that is disposed such that the multiple blocks are placed on the bottom plate. The top plate has a long side and a short side. Blocks included in the multiple blocks and disposed at the corners of the top plate each has a long side and a short side. The long side of each of the blocks included in the multiple blocks and disposed at the corners of the top plate is disposed along the short side of the top plate.

Pallet for packaging load object

A package unit includes: a base on which a packaged object is placed; a box that surrounds the packaged object; and a lid that covers the box such that a surface provided with an overlapping section where a sheet is folded and overlapped serves as a high impact resistance surface when the packaged object receives an impact.

Package unit

A support component includes a leg component having a male thread portion that is provided on at least an upper side of a rod extending in a height direction, and a pedestal portion that is provided larger than the rod and provided at a lower end portion of the rod, and a receiving component having a extruded portion that is provided, in a frame material including two vertically separated plate materials constituting a housing bottom portion of an equipment, in the plate material located on an upper side of the frame material and into which the male thread portion of the rod is screwed, and a through-hole that is provided in the plate material located on a lower side of the frame material and through which the rod passes, in which the support component enables height adjustment in a state in which the rod of the leg component is inserted through the extruded portion and the through-hole of the receiving component.

Growing community of inventors

Kanagawa, Japan

Naoto Chiba